EMI shielding product based on Polyether Sulphone (PES). Steel fibres. Glass fibres.

LNP COLORCOMP J1000 compound is based on unfilled Polyethersulfone (PES) resin.

LNP COLORCOMP J1000AE compound is based on unfilled Polyethersulfone (PES) resin. Added features of this grade include: Easy Molding.

LNP COLORCOMP J1000E compound is based on unfilled Polyethersulfone (PES) resin. Added features of this grade include: Easy Molding.

LNP COLORCOMP J1000ER compound is based on unfilled Polyethersulfone (PES) resin. Added features of this grade include: Easy Molding, Mold Release

LNP COLORCOMP J1000Z compound is based on Polyethersulfone (PES) resin. Added features of this grade include Extrudable.

LNP COLORCOMP JX09403J compound is based on Polyethersulfone (PES) resin. Added features of this grade include: Colorability, Healthcare, Low Extractables, Food Contact compliant

LNP LUBRICOMP JCL36 compound is based on Polyethersulfone (PES) resin containing 30% carbon fiber, 15% PTFE. Added features of this grade include: Internally Lubricated, Wear Resistant, Electrically Conductive.

LNP LUBRICOMP JFL36 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber, 15% PTFE. Added features of this grade include: Wear Resistant.

LNP LUBRICOMP JFL36 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber, 15% PTFE. Added features of this grade include: Wear Resistant.

LNP LUBRICOMP JX91198 compound is based on Polyethersulfone (PES) resin containing 10% Carbon Fiber, 10% PTFE and proprietary lubricant. Added features of this grade include: Wear Resistant.

LNP LUBRICOMP JX91198 compound is based on Polyethersulfone (PES) resin containing 10% Carbon Fiber, 10% PTFE and proprietary lubricant. Added features of this grade include: Wear Resistant.

LNP LUBRICOMP JZL012 compound is based on Polyethersulfone (PES) resin containing proprietary filler and PTFE. Added features of this grade include: Internally Lubricated, Wear Resistant, Dimensional Control.

LNP STAT-KON JX89626 compound is based on Polyethersulfone (PES) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP AM JC004XXAR1 is a compound based on PESU (Polyethersulfone) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing an inherent FR, reinforcement, and a high heat amorphous solution.

LNP THERMOCOMP JF002 compound is based on Polyethersulfone (PES) resin containing 10% glass fiber.

LNP THERMOCOMP JF002 compound is based on Polyethersulfone (PES) resin containing 10% glass fiber.

LNP THERMOCOMP JF002 compound is based on Polyethersulfone (PES) resin containing 10% glass fiber.

LNP THERMOCOMP JF002R compound is based on Polyethersulfone (PES) resin containing 10% glass fiber/glass bead. Added features of this grade include: Mold Release.

LNP THERMOCOMP JF003E compound is based on Polyethersulfone (PES) resin containing 15% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF004 compound is based on Polyethersulfone (PES) resin containing 20% glass fiber.

LNP THERMOCOMP JF004 compound is based on Polyethersulfone (PES) resin containing 20% glass fiber.

LNP THERMOCOMP JF004 compound is based on Polyethersulfone (PES) resin containing 20% glass fiber.

LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF004EXP compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF004L compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Low Extractables

LNP THERMOCOMP JF004RXP compound is based on Polyethersulfone (PES) resin containing glass fiber. Added features of this grade include: Mold Release.

LNP THERMOCOMP JF004Z compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: High Viscosity, suitable for Extrusion.

LNP THERMOCOMP JF006 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber.

LNP THERMOCOMP JF006 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber.

LNP THERMOCOMP JF006E compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF006E compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF006EXZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP JF006LXZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Low Extractables.

LNP THERMOCOMP JF006LZZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Extrusion grade, Low Extractables.

LNP THERMOCOMP JX97000 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Mold Release.

PTFE lubricated

High dimensionally stable precision parts, even at elevated temperatures and narrow tolerance range. Especially suitable for thin wall complex parts. Suitable for parts in contact with drinking water.