EPO-TEK® MED-302-3M Black is a biocompatible, black, opaque, medium viscosity epoxy. Additional characteristics are: high moisture and chemical resistance and is capable of low temperature curing. It has excellent adhesion to SST, ceramic, titanium and most plastics.

EPO-TEK® MED-302-3M is a biocompatible, clear and colorless, low viscosity epoxy, with high moisture and chemical resistance and is room temperature curing. Additional characteristics are: can be used in the optical pathway with transmission in the VIS/NIR range from 350-1550nm, easily wicks into fiber bundles for endoscopes and light guides, and has excellent adhesion to SST, ceramic, titanium and most plastics.

EPO-TEK® MED-302-3M-R is a biocompatible, clear and colorless, low viscosity epoxy designed to meet European Regulatory Requirements. It has high moisture and chemical resistance and is room temperature curing. Additional characteristics are: can be used in the optical pathway with transmission in the VIS/NIR range from 350-1550bnm easily wicks into fiber bundles for endoscopes and light guides, and has excellent adhesion to SST, ceramic, titanium and most plastics.

EPO-TEK® MED-320 is a black, biocompatible, thixototropic, low temperature curing, optically opaque epoxy for fiber optics, camera and photonic packaging, often used in bonding/potting/sealing of optics used in various medical imaging electronics.

EPO-TEK® MED-323LP is a biocompatible, high strength, high temperature, high Tg, long pot-life epoxy. It is used in many medical applications for adhesive, potting, sealing and encapsulation, especially suited for use in fiber optics, endoscope, implants and surgical tooling.

EPO-TEK® MED-353ND Black is a biocompatible, black, high Tg, high strength, high temperature epoxy, based on our well known EPO-TEK® 353ND adhesive. It was formulated for use in many medical applications, especially fiber optic, endoscopes, and implants.

EPO-TEK® MED-353ND is a biocompatible, high temperature, high Tg, and high strength epoxy. It has decades of use and reliability in medical device designs worldwide. Medical applications span from fiber optics and endoscopes, to implants, to diagnostic equipment, to imaging modalities, to surgical tooling. It has high adhesion to SST, titanium, ceramics, glass and most plastic, as well as high chemical and moisture resistance.

EPO-TEK® MED-353ND-T is a biocompatible, thixotropic formulated version of EPO-TEK® MED-353ND. It has non-flowing properties (paste/non- sagging) and high temperature resistance. Some additional characteristics are: built-in color change in curing, and high strength. It is design in many medical devices where a high strength, non- flow adhesive is desired.

EPO-TEK® MED-354 is a biocompatible, high Tg, medium viscosity epoxy with a very long (3 day) pot life used in many medical applications, especially fiber optic endoscopy. It has excellent adhesion to quartz, Au, kovar, SST and most plastics and like EPO-TEK® MED-353ND has a color change upon cure, and excellent autoclave resistance..

EPO-TEK® MED-354-T is a biocompatible, high Tg, thixotropic version of EPO-TEK® MED-354 epoxy. It is electrically and thermally insulating and formulated for medical applications with fiber optics, optoelectronic assemblies, as well as semiconductor packaging.

EPO-TEK® MED-375 is a biocompatibile, high Tg, high temperature epoxy. It has a color change upon cure and can provide near hermetic sealing. Additionally, it has excellent adhesion to many surfaces including: SST, titanium, ceramic, glass and most plastics. In designs, often used in potting fibers and active alignment of optics, as well as laminating PZT ferroelectrics in ultrasound applications.

EPO-TEK® MED-377 is a biocompatible, high Tg, high temperature epoxy. Due to its low viscosity, it is easy to use and can be applied easily by many methods. It has excellent chemical and moisture resistance, and often used in potting fibers for endoscopes.

EPO-TEK® MED-730-110 is a biocompatible, high Tg, medium viscosity, room temperature-curring, thermally and electrically insulating epoxy. it is easy to use and can be applied easily by many methods. It can be used for sealing, potting, or encapsulation applications found in many medical devices.

EPO-TEK® MED-H20E is a biocompatible, silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use. It is versatile in curing techniques; from box oven, to IR, to hot plate, to convection ovens and is used for circuit connections. Some typical applications are: pacemaker hybrid circuits, Xrays, ultrasound, and hearing aids using MEM or hybrid technology.

EPO-TEK® MED-H20S is a biocompatible, silver-filled epoxy with electrical and high thermal conductivity. It is a smooth low viscosity paste with fine Ag particles. It is a well characterized and highly reliability ECA, used most often for critical circuit connections and EMI coatings and has a curing time and temperature lower than EPO-TEK® MED-H20E.

EPO-TEK® MED-HYB-353ND is a biocompatible, high temperature specialty UV hybrid curing epoxy, formulated for process improvement (assembly) for photonic packaging. It has very high strength and moisture resistance.

EPO-TEK® MED-OD2002 is a biocompatible, high Tg, low modulus, high temperature epoxy, used primarily for fiber optics and endoscopes. It is highly autoclave resistant and when cured properly can withstand 1,000 autoclave cycles.

EPO-TEK® MED-OG116-31 is a biocompatible, one component, thixotropic, high Tg, cationic/epoxy UV curing adhesive. With thermal post curing, this UV has very high chemical resistance and is used in many types of implantable medical devices, specialized surgical and dental tools, as well as fiber optic lasers and catheters.

EPO-TEK® MED-OG198-55 is a single componet, electrically and thermally insulating, translucent cationic/epoxy UV with high viscosity, high Tg, and high strength. It is capable of curing in shadowed regions using an oven post-cure. It is used in many surgical and dental tools and specialized medical equipment, especially with active lens alignment and lasers.

EPO-TEK® MED-OG198-55 is a single componet, electrically and thermally insulating, translucent cationic/epoxy UV with high viscosity, high Tg, and high strength. It is capable of curing in shadowed regions using an oven post-cure. It is used in many surgical and dental tools and specialized medical equipment, especially with active lens alignment and lasers.

EPO-TEK® MED-T7110 is a thermally conductive, electrically insulating, low temperature curing epoxy; ideal for temperature sensitive devices. It is often used encapsulating copper coils in various medical imaging systems (X-ray, Nuclear and MRI).

EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditions include the optical, sensor, consumer, and industrial industries.

A white pigmented version of EPO-TEK® OD1001-67. It is a single component, electrically insulating epoxy designed as a low stress underfill adhesive for large die. It is also a more flowable version of EPO-TEK® TD1001-67.

EPO-TEK® OD121-42 (formerly R&D # 121-4-1) is a single component, low temperature cure epoxy with long pot life. It is designed for capillary underfill of heat sensitive electronic component packaging.

EPO-TEK® OD1361 (formerly R&D # 121-136-1) is an optically opaque epoxy. It is specially designed as the dam component for dam and fill applications in combination with either EPO-TEK® 121-136-3 or EPO-TEK® 121-136-4 fill formulations. It can be ussed for adhesive, sealing and encapsulation applications in semiconductor, electro-optics, fiber-optics, circuit assembly, medical and scientificOEM industries as well as for blocking out light in opto-packages.

EPO-TEK® OD1551 is an optically opaque epoxy. It is specially designed as the fill component for dam and fill applications in combination with EPO-TEK® OD1361 dam formulations. It can be used for adhesive, sealing and encapsulation applications in semiconductor, electro-optics, fiber optics, circuit assembly, medical and scientific/OEM industries as well as for blocking out light in opto-packages.

EPO-TEK® OD2002 is a two component, thermally and electrically insulating, optical epoxy. Designed as a high Tg yet still complilant alternative to EPO-TEK® 353ND.

A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive and sealing applications in electronics, optical, and medical devices.

A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.

A clear, flexible epoxy used for low stress adhesive and potting applications.

A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the electronics, medical, and optical industries. It is a black version of EPO-TEK® OE121.

A two component, optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23°C to 80°C, suggested for opto-device flip chip packaging. It can also be used for general potting and encapsulation.

EPO-TEK® OE138 is a two component epoxy with intermediate viscosity range between EPO-TEK®353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in medical and fiber optic industries.

A slightly thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating.

A thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component slightly thixotropic epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating.

A slightly thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating. It is an enhanced adhesion version of EPO-TEK® OE145-4 with superior 85° C/85% RH resistance.

Thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating. It also exhibits enhanced adhesion to metals and glass.

EPO-TEK® OE175-2 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is a modified alternative to EPO-TEK® 375 with improved wetting. Also available in a single component frozen syringe.

A two component, high Tg, optically clear epoxy for packaging and assembly of fiber optics cables and components. It is suggested for termination of fibers into ferrules, or fabrication of waveguide devices. It is a faster curing alternative to EPO-TEK® 353ND.

EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications.