A single component, electrically insulating, thermally conductive epoxy adhesive for semiconductor, hybrid packaging and electronic circuit assembly applications. It is a higher viscosity alternative to EPO-TEK® H62.

EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

EPO-TEK® H67MP is a single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD-883/Test Method 5011 for hybrid microelectronic packaging and assemblies. It maybe used for bonding SMDs, die-attach, substrate-attach or general heat sinking. It is a version of EPO-TEK® H67MP which contains 2 mil glass beads.

A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD 883, Test Method 5011 for hybrid microelectronic packaging and assemblies. It may be used for bonding SMDs, die-attach, substrate-attach or general heat sinking. Meets MIL-STD-883, Method 5011. A thixotropic version of EPO-TEK® H67MP.

EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

A two component, thermally conductive, electrically insulating epoxy adhesive designed for semiconductor and microelectronic packaging. It is most commonly used for die-attach and heat sinking applications.

EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of hybrid circuits or at the SMD/PCB level.

A two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.

EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.

A two component, thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.

EPO-TEK® H70E-4 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD / PCB level.

A two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronic applications.

A two component, thermally conductive, low halogen, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronic applications.

EPO TEK® H70S is a modified version of EPO TEK ® H70E, designed primarily for die stamping. It is a highly reliable, alumina- filled epoxy with a smooth, flowable consistency, designed for chip bonding in micro-electronic and opto-electronic applications.

EPO-TEK® H72 is a two component, high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies.

EPO-TEK® H73 is a two component, thermally conductive, electrically insulating epoxy. It is a higher viscosity alternative to EPO-TEK® H74.

EPO TEK® H74 is a two component, thermally conductive epoxy designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.

A two component, electrically and thermally insulating epoxy adhesive designed for semiconductor, electronics, and optical applications. It is an IR transparent version of EPO-TEK H74 which enables fiber optic and photonic packaging. Due to its low viscosity, it is useful for sealing, potting and encapsulation projects.

A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip underfill, sealing sensor devices packaged in TO-cans or fiber optic feed-through. It may be considered a finer particle version of EPO-TEK® H74.

A two component, thermally conductive, epoxy designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general. It is a fluorescent version of EPO-TEK®H74 for inline inspection.

A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity alternative to EPO-TEK® H74.

EPO-TEK® H77 Black is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.

EPO-TEK® H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.

A two component, thermally conductive, electrically insulating epoxy designed for high temperature applications. It is a smaller particle size version of EPO-TEK® H77.

EPO-TEK® H77T is a two component, thermally conductive, electrically insulating epoxy designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.

EPO-TEK® H81 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid micro-electronic and semiconductor packaging.

A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.

A single component epoxy for fiber optic and semiconductor applications. It is designed to have similar cured performance to EPO-TEK® 301-2, but has been modified to allow for initial UV tacking to simplify the production process and save production time.

Single component epoxy for fiber optic and semiconductor applications. It is a higher viscosity version of EPO-TEK® HYB-297-RT. It is designed to have similar cured performance to EPO-TEK® 301-2, but has been modified to allow for initial UV tacking to simplify the production process and save production time.

A single component, high temperature hybrid epoxy for semiconductor, fiber optic and medical applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

A single component, high temperature epoxy for semiconductor, hybrid, fiber optic, and medical applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of EPO-TEK® HYB-353ND.

A single component, high temperature hybrid epoxy for semiconductor, fiber optic and medical applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of EPO-TEK® HYB-353ND.

A single component, high temperature hybrid epoxy for semiconductor, fiber optic and medical applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher thixotropy version of EPO-TEK® HYB-353ND.

A single component, high temperature hybrid epoxy for semiconductor, fiber optic and medical applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher thixotropy version of EPO-TEK® HYB-353ND.

A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. In opto-packaging, it can be used as the main gasket seal of glass plates in LCDs, or for sealing filter windows onto opto-sensors.

A single component, B-stageable, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed-through into the opto-package. B-stage adhesive joining of glass or optics can also be realized.

EPO-TEK® MED-301 is a biocompatible, spectrally transparent, very low viscosity, room temperature curing epoxy. Additional characteristics are: self-leveling, short pot-life, and ease of application, either by dispensing or manual operation. EPO-TEK® MED 301 is used often in molding headers in pacemakers, cochlear implants and neurostimulator implants, as well as bonding in many other types of medical devices. When longer pot-life, lower stress and large-scale manufacturing is needed, EPO-TEK® MED 301-2 can usually be interchanged.

EPO-TEK® MED-301-2 is a biocompatible, clear and colorless, low viscosity, long pot-life, room temperature curing epoxy. Additional characteristics are: ease of use in potting and casting, excellent adhesion to glass, quartz, wood and most plastics. As a compliant, low stress adhesive, it is used in bonding of optics and resistant to impact or vibrations. Used often in endoscopes and in various imaging systems.

EPO-TEK® MED-301-2FL is a biocompatible, low temperature curing, low stress and more flexible version of MED-301-2. It is used in fiber optic applications as well as potting, casting and laminating; with excellent adhesion to glass, quartz, metals and most plastics.