DuPont™ Kapton® B polyimide film exhibits an excellent balance of physical, chemical, and electrical properties over a wide temperature range, with superior dimensional stability at elevated temperatures. DuPont™ Kapton® B is a black, homogeneous opaque film. The matte black color of Kapton® B provides a uniform, aesthetically pleasing appearance while maintaining key physical properties. The homogeneous pigmentation provides better color integrity against flexural cracking or abrasion in comparison to black coatings or dyes. These characteristics make it ideal for use in many industrial applications where opacity, low reflectivity, or aesthetics are required. Applications-Black films for use in: • Heaters, Antenna, LED circuitry and stiffeners requiring Black aesthetics • Applications requiring laser ablation Product Specifications DuPont™ Kapton® B polyimide film is manufactured, slit and packaged according to the product specifications listed in EI-10167, General Specification Bulletin.

DuPont™ Kapton® corona resistant film is a state of the art polyimide film that withstands the damaging effects of corona discharge. The corona resistance of Kapton® 100CRC film provides improved service life and operational efficiencies beyond that of conventional insulation materials. In addition to the corona resistant properties, Kapton® CRC offers excellent, physical, electrical, thermal, and chemical resistant characteristics expected with Kapton® polyimide films. Kapton® CRC polyimide film has been developed for use as an electrically insulating material for high voltage environments where the potential for corona discharge is present. Kapton® CRC is typically used in industrial motor and generator applications as magnet wire, turn to turn strand, coil, slot liner and ground insulation materials. It has also been used to form laminates with other materials, such as DuPont™ Nomex® paper or mica insulations, to provide a tailored electrical insulation property. Applications • AC Inverter Duty Motors • Rail, Automotive Traction Motors • Hydro, Wind Power Generators • Transformers

DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® EN is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer. The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film. Kapton® EN film also has very low moisture absorption and is laser ablatable. Applications • Flexible printed circuits • Fine pitch circuitry • Chip scale packaging • High density interconnects Key Features • Thinnest polyimide film available Worldwide. Provides for thinner devices and narrower bezel designs • Excellent dimensional stability with low CTE matching copper • Low curl, high dynamic flexibility and excellent bend-to-install performance • Higher modulus film with lower water uptake • Consistent lot-to-lot quality

DuPont™ Kapton® MT polyimide film is a homogeneous film possessing 3x the thermal conductivity and cut through strength of standard Kapton® HN. Its thermal conductivity properties make it ideal for use in controlling and managing heat in electronic assemblies such as printed circuit boards. Kapton® MT offers an excellent combination of electrical properties, thermal conductivity and mechanical toughness for its use in electronic and automotive applications. Kapton® MT has higher modulus than HN; this offers improved strength to the final product. As all Kapton® films, MT retains its properties for extended storage periods in original packaging at temperatures between 4–29°C (40–85°F). Applications • Insulation pads (heat sink) • Heater circuits • Power supplies • Ceramic board replacement • NKN slot liners

These specifications include the values and tolerances for Kapton® PST film properties and the characteristics known to be of significance to coaters, laminators and manufacturers of pressure sensitive adhesive tape. Any aspects of the specifications that require further interpretation or clarification should be discussed with representatives of DuPont Interconnect Solutions. Kapton® PST is a tough film that exhibits an excellent balance of physical, chemical and electrical properties over a wide temperature range, particularly at unusually high temperatures. The film is available in 50, 100, 200, 300 and 500 gauges

Product Description/Features • Thermally conductive Kapton® (3x more than standard Kapton®) • Low moisture permeation • High temperature resistance • High tear strength • 1.0 mil (25 µm) thick thermally conductive Kapton® base film • 0.1 mil (2.5 µm) thick FEP coating on both sides Applications • Heater insulation • Flat panel heater substrate • High temperature insulating wrap

DuPont™ Kapton® FN is a general purpose HN film that is coated or laminated on one or both sides with FEP fluoropolymer. Kapton® FN imparts heat sealability, provides a moisture barrier, and enhances chemical resistance. Kapton® FN is recommended in applications that require a heat bondable film, or moisture and chemical resistance beyond the capabilities of uncoated Kapton® films. A list of available constructions can be found in the DuPont™ Kapton® polyimide film general specification, EI-10167. Applications • Tubing • Heater circuits • Heat sealable bags • Automotive diaphragms and manifolds • Electrical insulation Product Specifications Kapton® FN is manufactured, slit and packaged according to the product specifications listed in EI-10167, DuPont™ Kapton® polyimide film general specification. Certification Kapton® FN meets ASTM D5213 (type 2, item A) requirements.

Kapton® 120FWN616B is a multi-layer composite film. This composite film offers the superior balance of physical, electrical, thermal, and chemical resistant properties found in Kapton® polyimide film and FEP fluoropolymer materials. Kapton® 120FWN616B is heat fusible to copper and to itself enabling reliable and thin spiral wrapped electrical insulation. This capability makes it ideal as an electrical insulation material for copper conductors used in demanding magnet wire applications where good adhesion and dielectric properties are desired. Kapton® 120FWN616B composite construction consists of a layer 25 micron thick polyimide film core between two 4 micron thick layers of improved high temperature FEP fluoropolymer adhesive. The final, balanced construction is nominally 33 microns thick. Characteristics • Heat fusible adhesive • High dielectric strength • Double side coated • Thin, light weight Applications • Magnet wire • Traction motors: rail, auto, mining • Industrial motor insulation • Wind, hydro generators • High temperature • High reliability

DuPont™ Kapton® EN-A, EN-C and EN-Z are the premium performance polyimide films for use as a dielectric substrate for chip on film, ?exible printed circuits and high density interconnects. These polyimide films show superior surface quality, high modulus, and excellent CTE control, which makes them preferred dielectric films for very fine pitch circuity and next generation IC packaging application Applications • Chip on Film (COF) • Metallized FPC • Semiconductor • Package TFT Key Features • Very low surface roughness, ideal for sputtering processes • Wide CTE line ups from ultra low to low, targetting to match various materials silicone, glass, and copper. • Stable dimensional stability over wide temperature range 140EN-Z: Ultra low CTE isotropic

DuPont™ Kapton® EN-A, EN-C and EN-Z are the premium performance polyimide films for use as a dielectric substrate for chip on film, ?exible printed circuits and high density interconnects. These polyimide films show superior surface quality, high modulus, and excellent CTE control, which makes them preferred dielectric films for very fine pitch circuity and next generation IC packaging application Applications • Chip on Film (COF) • Metallized FPC • Semiconductor • Package TFT Key Features • Very low surface roughness, ideal for sputtering processes • Wide CTE line ups from ultra low to low, targetting to match various materials silicone, glass, and copper. • Stable dimensional stability over wide temperature range 150EN-A: Low CTE anisotropic

DuPont™ Kapton® EN-A, EN-C and EN-Z are the premium performance polyimide films for use as a dielectric substrate for chip on film, ?exible printed circuits and high density interconnects. These polyimide films show superior surface quality, high modulus, and excellent CTE control, which makes them preferred dielectric films for very fine pitch circuity and next generation IC packaging application Applications • Chip on Film (COF) • Metallized FPC • Semiconductor • Package TFT Key Features • Very low surface roughness, ideal for sputtering processes • Wide CTE line ups from ultra low to low, targetting to match various materials silicone, glass, and copper. • Stable dimensional stability over wide temperature range 150EN-C: Normal CTE isotropic

DuPont™ Kapton® corona resistant film is a state-of-the-art polyimide film that withstands the damaging effects of corona discharge. The corona resistance provides improved service life and operational efficiencies versus conventional insulation materials. Kapton® 150FCRC019 is a composite film consisting of Kapton® 100CRC corona resistant polyimide film and a heat fusible FEP fluoropolymer film. In addition to the corona resistant property, Kapton® FCRC offers excellent, physical, electrical, thermal, and chemical resistant characteristics expected with Kapton® polyimide films. Kapton® 150FCRC019 has been developed for use as a magnet wire insulation in rail traction, industrial motors and generators where there is a need for enhanced insulation life under partial discharge environments. Kapton® FCRC may also be used in other electrically insulating applications where partial discharge may occur. Characteristics • Corona resistant film • Heat fusible adhesive • High dielectric strength • Reduced thickness versus mica laminates Applications • Magnet wire • Traction motors: rail, auto, mining • Industrial motor insulation • Wind, hydro generators • ESP motors • High temperature • High reliability • Aerospace and specialty wires

DuPont™ Kapton® FN is a general purpose HN film that is coated or laminated on one or both sides with FEP fluoropolymer. Kapton® FN imparts heat sealability, provides a moisture barrier, and enhances chemical resistance. Kapton® FN is recommended in applications that require a heat bondable film, or moisture and chemical resistance beyond the capabilities of uncoated Kapton® films. A list of available constructions can be found in the DuPont™ Kapton® polyimide film general specification, EI-10167. Applications • Tubing • Heater circuits • Heat sealable bags • Automotive diaphragms and manifolds • Electrical insulation Product Specifications Kapton® FN is manufactured, slit and packaged according to the product specifications listed in EI-10167, DuPont™ Kapton® polyimide film general specification. Certification Kapton® FN meets ASTM D5213 (type 2, item A) requirements.

DuPont™ Kapton® 150FWN019 is a two-layer, polyimide, FEP fluoropolymer dispersion-coated heat-fusible composite film with a unique balance of excellent physical, electrical, thermal durability and chemical resistance properties. 150FWN019 has superior scrape abrasion resistance and motor manuacturers have reported that wire insulated with 150FWN019 exhibits lower frictional properties than wire insulated with other commonly used polyimide materials. 150FWN019 is ideal for demanding magnet wire applications. and for difficult-to-wind motors. Characteristics • Excellent scrape abrasion resistance • High bond strength, heat fusible • UL 94 V-0 compliance • High dielectric strength • High wire production yields

DuPont™ Kapton® FWR is a heat fusible polyimide-FEP fluoropolymer composite film that has a unique balance of excellent electrical, thermal durability, and chemical resistance properties. The properties of Kapton® FWR will provide a tough, high dielectric strength insulation with significantly improved hydrolysis resistance compared to other commonly used polyimide materials. Kapton® FWR can be properly processed on most tape wrapping machines. It can be fused using either induction or radiant heat. Kapton® FWR films have a higher modulus and lower water vapor permeability than equivalent Kapton® FN films. The wire wrapping and sealing process may have to be modified to compensate for these differences. Kapton® 150FWR019 film is constructed of a 1.0 mil Kapton® polyimide film with 0.5 mil of FEP fluoropolymer on one side. Kapton® 200FWR919 film is constructed of a 1.0 mil Kapton® polyimide film with 0.5 mil of FEP fluoropolymer on each side. Characteristics • Excellent hydrolysis resistance • UL 94 recognition: V-0 • High dielectric strength • Mechanically Tough • Heat Fusible Applications • Magnet wire • Traction motors: rail, auto, mining • Industrial motor insulation • Wind, hydro generators • ESP motors • High temperature • High reliability • Aerospace and specialty wires

DuPont™ Kapton® MT polyimide film is a homogeneous film possessing 3x the thermal conductivity and cut through strength of standard Kapton® HN. Its thermal conductivity properties make it ideal for use in controlling and managing heat in electronic assemblies such as printed circuit boards. Kapton® MT offers an excellent combination of electrical properties, thermal conductivity and mechanical toughness for its use in electronic and automotive applications. Kapton® MT has higher modulus than HN; this offers improved strength to the final product. As all Kapton® films, MT retains its properties for extended storage periods in original packaging at temperatures between 4–29°C (40–85°F). Applications • Insulation pads (heat sink) • Heater circuits • Power supplies • Ceramic board replacement • NKN slot liners

The properties of DuPont™ Kapton® 150PRN411 make it suitable for insulating copper conductor used in high temperature magnet wire applications where improved adhesion between layers and abrasion resistance are desired. Kapton® 150PRN411 polyimide film consists of a layer of 25 micron thick Kapton® HN polyimide film between two layers of high melt temperature fluoropolymer. One of the fluoropolymer layers is approximately ten microns thick and the second layer is approximately three microns thick. Characteristics • High performance adhesive system • Advanced abrasion resistance • High temperature, >240°C • Reliable thermal durability • Chemical resistance Applications • Magnet wire • ESP motors • Traction motors: rail, auto, & mining • Industrial motor insulation • Wind & hydro generators

Kapton® type XP provides a type H film coated on one or both sides with a proprietary fluorocarbon resin which provides excellent mechanical strength and adhesive properties at elevated temperatures. In addition, high level bond strengths of XP to copper, itself or other materials are maintained at elevated temperatures. The four graphs included with this bulletin compare retention of bond strength of type FN and type XP from room temperature to 200°C. Kapton® XP exhibits the same chemical stability, electrical properties, and mechanical strengths in high and low temperature environments as has been demonstrated with Kapton® FN. Both 2 mil Kapton® XP (919) and 1.5 mil XP (019) are in inventory. Other constructions can be made available as market applications and needs develop. Substrate preparation and electrical, mechanical and chemical data can be found in the Kapton® Summary of Properties booklet (EI-10142).

DuPont™ Kapton® B polyimide film exhibits an excellent balance of physical, chemical, and electrical properties over a wide temperature range, with superior dimensional stability at elevated temperatures. DuPont™ Kapton® B is a black, homogeneous opaque film. The matte black color of Kapton® B provides a uniform, aesthetically pleasing appearance while maintaining key physical properties. The homogeneous pigmentation provides better color integrity against flexural cracking or abrasion in comparison to black coatings or dyes. These characteristics make it ideal for use in many industrial applications where opacity, low reflectivity, or aesthetics are required. Applications-Black films for use in: • Heaters, Antenna, LED circuitry and stiffeners requiring Black aesthetics • Applications requiring laser ablation Product Specifications DuPont™ Kapton® B polyimide film is manufactured, slit and packaged according to the product specifications listed in EI-10167, General Specification Bulletin.

DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® EN is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer. The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film. Kapton® EN film also has very low moisture absorption and is laser ablatable. Applications • Flexible printed circuits • Fine pitch circuitry • Chip scale packaging • High density interconnects Key Features • Thinnest polyimide film available Worldwide. Provides for thinner devices and narrower bezel designs • Excellent dimensional stability with low CTE matching copper • Low curl, high dynamic flexibility and excellent bend-to-install performance • Higher modulus film with lower water uptake • Consistent lot-to-lot quality

DuPont™ Kapton® FWR is a heat fusible polyimide-FEP fluoropolymer composite film that has a unique balance of excellent electrical, thermal durability, and chemical resistance properties. The properties of Kapton® FWR will provide a tough, high dielectric strength insulation with significantly improved hydrolysis resistance compared to other commonly used polyimide materials. Kapton® FWR can be properly processed on most tape wrapping machines. It can be fused using either induction or radiant heat. Kapton® FWR films have a higher modulus and lower water vapor permeability than equivalent Kapton® FN films. The wire wrapping and sealing process may have to be modified to compensate for these differences. Kapton® 150FWR019 film is constructed of a 1.0 mil Kapton® polyimide film with 0.5 mil of FEP fluoropolymer on one side. Kapton® 200FWR919 film is constructed of a 1.0 mil Kapton® polyimide film with 0.5 mil of FEP fluoropolymer on each side. Characteristics • Excellent hydrolysis resistance • UL 94 recognition: V-0 • High dielectric strength • Mechanically Tough • Heat Fusible Applications • Magnet wire • Traction motors: rail, auto, mining • Industrial motor insulation • Wind, hydro generators • ESP motors • High temperature • High reliability • Aerospace and specialty wires

DuPont™ Kapton® MT polyimide film is a homogeneous film possessing 3x the thermal conductivity and cut through strength of standard Kapton® HN. Its thermal conductivity properties make it ideal for use in controlling and managing heat in electronic assemblies such as printed circuit boards. Kapton® MT offers an excellent combination of electrical properties, thermal conductivity and mechanical toughness for its use in electronic and automotive applications. Kapton® MT has higher modulus than HN; this offers improved strength to the final product. As all Kapton® films, MT retains its properties for extended storage periods in original packaging at temperatures between 4–29°C (40–85°F). Applications • Insulation pads (heat sink) • Heater circuits • Power supplies • Ceramic board replacement • NKN slot liners

These specifications include the values and tolerances for Kapton® PST film properties and the characteristics known to be of significance to coaters, laminators and manufacturers of pressure sensitive adhesive tape. Any aspects of the specifications that require further interpretation or clarification should be discussed with representatives of DuPont Interconnect Solutions. Kapton® PST is a tough film that exhibits an excellent balance of physical, chemical and electrical properties over a wide temperature range, particularly at unusually high temperatures. The film is available in 50, 100, 200, 300 and 500 gauges

DuPont™ Kapton® 200RS100 is a two layer polyimide film with an electrically conductive layer on one side and a dielectric insulator on the other side. The temperature is highly customizable based on distance between electrodes and can be designed for temperatures up to 200°C in continuous heating. Only for short term use, the film can reach 240°C. Kapton® RS has proven performance in applications where a precisely controlled surface resistivity was needed. It provides a durable resistivity, which is only slightly affected by temperature and humidity changes. Kapton® RS film retains all the outstanding inertness, radiation and temperature resistance of other Kapton® polyimide films, which make them ideal for use in extreme environments. Heating applications requiring thin, light-weight, uniform or high temperature performance would benefit from this all-polyimide conductive film. Given the low thermal mass, this material is a more efficient heater than other systems. The material is not limited by inputs such as current or voltage and can be designed for any output temperature desired. It can also be easily cut into various configurations and will continue to function even if it has been punctured. Due to its polyimide composition, it is resilient to high temperature, thin, and highly flexible. Characteristics • High Tg • Conductive side: black matte surface • Dielectric side: shiny smooth surface • Durable from -270°C to 200°C • Thermally durable to 325°C in oxygen-free environments Applications • Surface Deicing • Automotive Interior Heating • Aerospace Temperature Regulation • Industrial Tube Heating • Composite Curing • Wearables • Consumer Appliances

Kapton® type XP provides a type H film coated on one or both sides with a proprietary fluorocarbon resin which provides excellent mechanical strength and adhesive properties at elevated temperatures. In addition, high level bond strengths of XP to copper, itself or other materials are maintained at elevated temperatures. The four graphs included with this bulletin compare retention of bond strength of type FN and type XP from room temperature to 200°C. Kapton® XP exhibits the same chemical stability, electrical properties, and mechanical strengths in high and low temperature environments as has been demonstrated with Kapton® FN. Both 2 mil Kapton® XP (919) and 1.5 mil XP (019) are in inventory. Other constructions can be made available as market applications and needs develop. Substrate preparation and electrical, mechanical and chemical data can be found in the Kapton® Summary of Properties booklet (EI-10142).

DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® EN is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer. The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film. Kapton® EN film also has very low moisture absorption and is laser ablatable. Applications • Flexible printed circuits • Fine pitch circuitry • Chip scale packaging • High density interconnects Key Features • Thinnest polyimide film available Worldwide. Provides for thinner devices and narrower bezel designs • Excellent dimensional stability with low CTE matching copper • Low curl, high dynamic flexibility and excellent bend-to-install performance • Higher modulus film with lower water uptake • Consistent lot-to-lot quality

DuPont™ Kapton® FN is a general purpose HN film that is coated or laminated on one or both sides with FEP fluoropolymer. Kapton® FN imparts heat sealability, provides a moisture barrier, and enhances chemical resistance. Kapton® FN is recommended in applications that require a heat bondable film, or moisture and chemical resistance beyond the capabilities of uncoated Kapton® films. A list of available constructions can be found in the DuPont™ Kapton® polyimide film general specification, EI-10167. Applications • Tubing • Heater circuits • Heat sealable bags • Automotive diaphragms and manifolds • Electrical insulation Product Specifications Kapton® FN is manufactured, slit and packaged according to the product specifications listed in EI-10167, DuPont™ Kapton® polyimide film general specification. Certification Kapton® FN meets ASTM D5213 (type 2, item A) requirements.

DuPont™ Kapton® B polyimide film exhibits an excellent balance of physical, chemical, and electrical properties over a wide temperature range, with superior dimensional stability at elevated temperatures. DuPont™ Kapton® B is a black, homogeneous opaque film. The matte black color of Kapton® B provides a uniform, aesthetically pleasing appearance while maintaining key physical properties. The homogeneous pigmentation provides better color integrity against flexural cracking or abrasion in comparison to black coatings or dyes. These characteristics make it ideal for use in many industrial applications where opacity, low reflectivity, or aesthetics are required. Applications-Black films for use in: • Heaters, Antenna, LED circuitry and stiffeners requiring Black aesthetics • Applications requiring laser ablation Product Specifications DuPont™ Kapton® B polyimide film is manufactured, slit and packaged according to the product specifications listed in EI-10167, General Specification Bulletin.

DuPont™ Kapton® MT polyimide film is a homogeneous film possessing 3x the thermal conductivity and cut through strength of standard Kapton® HN. Its thermal conductivity properties make it ideal for use in controlling and managing heat in electronic assemblies such as printed circuit boards. Kapton® MT offers an excellent combination of electrical properties, thermal conductivity and mechanical toughness for its use in electronic and automotive applications. Kapton® MT has higher modulus than HN; this offers improved strength to the final product. As all Kapton® films, MT retains its properties for extended storage periods in original packaging at temperatures between 4–29°C (40–85°F). Applications • Insulation pads (heat sink) • Heater circuits • Power supplies • Ceramic board replacement • NKN slot liners

These specifications include the values and tolerances for Kapton® PST film properties and the characteristics known to be of significance to coaters, laminators and manufacturers of pressure sensitive adhesive tape. Any aspects of the specifications that require further interpretation or clarification should be discussed with representatives of DuPont Interconnect Solutions. Kapton® PST is a tough film that exhibits an excellent balance of physical, chemical and electrical properties over a wide temperature range, particularly at unusually high temperatures. The film is available in 50, 100, 200, 300 and 500 gauges

DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® EN is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer. The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film. Kapton® EN film also has very low moisture absorption and is laser ablatable. Applications • Flexible printed circuits • Fine pitch circuitry • Chip scale packaging • High density interconnects Key Features • Thinnest polyimide film available Worldwide. Provides for thinner devices and narrower bezel designs • Excellent dimensional stability with low CTE matching copper • Low curl, high dynamic flexibility and excellent bend-to-install performance • Higher modulus film with lower water uptake • Consistent lot-to-lot quality

DuPont™ Kapton® B polyimide film exhibits an excellent balance of physical, chemical, and electrical properties over a wide temperature range, with superior dimensional stability at elevated temperatures. DuPont™ Kapton® B is a black, homogeneous opaque film. The matte black color of Kapton® B provides a uniform, aesthetically pleasing appearance while maintaining key physical properties. The homogeneous pigmentation provides better color integrity against flexural cracking or abrasion in comparison to black coatings or dyes. These characteristics make it ideal for use in many industrial applications where opacity, low reflectivity, or aesthetics are required. Applications-Black films for use in: • Heaters, Antenna, LED circuitry and stiffeners requiring Black aesthetics • Applications requiring laser ablation Product Specifications DuPont™ Kapton® B polyimide film is manufactured, slit and packaged according to the product specifications listed in EI-10167, General Specification Bulletin.

These specifications include the values and tolerances for Kapton® PST film properties and the characteristics known to be of significance to coaters, laminators and manufacturers of pressure sensitive adhesive tape. Any aspects of the specifications that require further interpretation or clarification should be discussed with representatives of DuPont Interconnect Solutions. Kapton® PST is a tough film that exhibits an excellent balance of physical, chemical and electrical properties over a wide temperature range, particularly at unusually high temperatures. The film is available in 50, 100, 200, 300 and 500 gauges

DuPont™ Kapton® B polyimide film exhibits an excellent balance of physical, chemical, and electrical properties over a wide temperature range, with superior dimensional stability at elevated temperatures. DuPont™ Kapton® B is a black, homogeneous opaque film. The matte black color of Kapton® B provides a uniform, aesthetically pleasing appearance while maintaining key physical properties. The homogeneous pigmentation provides better color integrity against flexural cracking or abrasion in comparison to black coatings or dyes. These characteristics make it ideal for use in many industrial applications where opacity, low reflectivity, or aesthetics are required. Applications-Black films for use in: • Heaters, Antenna, LED circuitry and stiffeners requiring Black aesthetics • Applications requiring laser ablation Product Specifications DuPont™ Kapton® B polyimide film is manufactured, slit and packaged according to the product specifications listed in EI-10167, General Specification Bulletin.

DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® EN is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer. The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film. Kapton® EN film also has very low moisture absorption and is laser ablatable. Applications • Flexible printed circuits • Fine pitch circuitry • Chip scale packaging • High density interconnects Key Features • Thinnest polyimide film available Worldwide. Provides for thinner devices and narrower bezel designs • Excellent dimensional stability with low CTE matching copper • Low curl, high dynamic flexibility and excellent bend-to-install performance • Higher modulus film with lower water uptake • Consistent lot-to-lot quality

These specifications include the values and tolerances for Kapton® PST film properties and the characteristics known to be of significance to coaters, laminators and manufacturers of pressure sensitive adhesive tape. Any aspects of the specifications that require further interpretation or clarification should be discussed with representatives of DuPont Interconnect Solutions. Kapton® PST is a tough film that exhibits an excellent balance of physical, chemical and electrical properties over a wide temperature range, particularly at unusually high temperatures. The film is available in 50, 100, 200, 300 and 500 gauges

DuPont™ Kapton® FPC polyimide film is treated on both sides and has the same excellent balance of physical, chemical and electrical properties over a wide temperature range offered by general purpose Kapton® HN. Kapton® FPC offers superior dimensional stability and adhesion, and is specifically designed for flex circuit manufacturers. Adhesion data for FPC can be referenced in the adhesion to Kapton® technical bulletin. In applications where superior adhesion and low shrinkage are important, Kapton® FPC is the polyimide film of choice. Applications • Flexible printed circuits • Military applications • Automotive • Aerospace • Computers • Electronic parts • Consumer products • PCB stencils • Telecommunications equipment • Screen printing • Industrial instrumentation and controls • Insulation tubing Product Specifications Kapton® FPC is manufactured, slit and packaged according to the product specifications listed in H-38479 (6/18). Certification Kapton® FPC meets IPC 4202B requirements..

DuPont™ Kapton® HN general-purpose film has been used successfully in applications at temperatures as low as -269°C (-452°F) and as high as 400°C (752°F). HN film can be laminated, metallized, punched, formed or adhesive coated. Kapton® HN is the recommended choice for applications that require an all-polyimide film with an excellent balance of properties over a wide range of temperatures. Applications • Mechanical parts • Electronic parts • Electrical Insulation • Pressure sensitive tape • Fiber optics cable • Insulation blankets • Insulation tubing • Automotive diaphragms sensors and manifolds • Etching • Shims Product Specifications Kapton® HN is manufactured, slit and packaged according to the product specifications listed in H-38479 (6/18). Certification Kapton® HN meets ASTM D-5213 (type 1, item A) requirements.

DuPont™ Kapton® HPP-ST is a two-sided, treated film that offers the same excellent balance of physical, chemical, and electrical properties over a wide temperature range offered by general purpose Kapton® HN. Additionally, this high performance film has superior dimensional stability and excellent adhesion with most adhesion systems. Adhesion data for HPP-ST can be referenced in the adhesion to Kapton® technical bulletin. In applications where low shrinkage and superior adhesion are important, Kapton® HPP-ST is the polyimide film of choice. Applications • Electronic parts • PCB stencils • Screen printing • Insulation tubing Product Specifications Kapton® HPP-ST is manufactured, slit and packaged according to the product specifications listed in H-38479 (6/18). Certification Kapton® HPP-ST meets ASTM D-5213 (type 1, item A) requirements.