Kapton® type XP provides a type H film coated on one or both sides with a proprietary fluorocarbon resin which provides excellent mechanical strength and adhesive properties at
elevated temperatures.

In addition, high level bond strengths of XP to copper, itself or other materials are maintained at elevated temperatures. The four graphs included with this bulletin compare retention of bond strength of type FN and type XP from room temperature to 200°C.

Kapton® XP exhibits the same chemical stability, electrical properties, and mechanical strengths in high and low temperature environments as has been demonstrated with Kapton® FN.

Both 2 mil Kapton® XP (919) and 1.5 mil XP (019) are in inventory.
Other constructions can be made available as market applications and needs develop.
Substrate preparation and electrical, mechanical and chemical data can be found in the Kapton® Summary of Properties booklet (EI-10142).