EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.

EPO-TEK ® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.

EPO-TEK® H20E-D is a single component, 100% solids, silver-filled epoxy designed for electrically and thermally conductive bonds. It is an enhanced version of EPO-TEK® H20E.

EPO-TEK® H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.

EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. Also available in a single component frozen syringe. This is an increased thermal conductivity version of EPO-TEK H20E.

EPO-TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is the conductive adhesive of choice for low chloride applications.

EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a low viscosity version of EPO-TEK® H20E, semiconductor die-attach epoxy.

EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.

EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.

A single component, semiconductor-grade epoxy designed for improved dispensing.

EPO-TEK® H20E-PFC-T (formerly R&D #111-16-2) is a two component, semiconductor grade epoxy, designed as a higher viscosity version of EPO-TEK® H20E-PFC.

EPO-TEK® H20E-SLR is a two-component, electrically conductive, epoxy adhesive designed for meter mix dispensing applications. It is desgined for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels.

EPO-TEK® H20E-SLR-HV is a two-component, electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels. It is a higher viscosity version of EPO-TEK H20E-SLR.

EPO-TEK® H20E-SLR-HVMX is a two-component, electrically conductive, epoxy for meter mix dispensing applications. It is designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels. It is a higher viscosity version of EPO-TEK H20E-SLR-MX.

EPO-TEK® H20E-SLR-MX is a two-component, electrically conductive, epoxy for meter mix dispensing applications. It is designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels.

EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate attach.

EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK® H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK® H20S is extremely simple to use.

A single component, silver-filled epoxy with a smooth, thixotropic consistency. It is a version of EPO-TEK® H20S designed primarily for enhanced dispensing.

EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications.

EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.

EPO-TEK ® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.

EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.

EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging.

EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC's, resistors, capacitors, transistors, and diodes which may be found in opto-electronics packaging or hybrid micro-electronics.

A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. It is a NASA approved low outgassing epoxy. It is a lower viscosity version of EPO-TEK® H31D.

EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Low viscosity version of EPO-TEK® H31.

EPO-TEK® H35-175MP is a single component, silver-filled epoxy for hybrid die and component attach.

EPO-TEK® H35-175MPLV is a single component, silver-filled epoxy for hybrid die and component attach. It is a lower viscosity version of EPO-TEK® H35-175MP.

EPO-TEK® H35-175MPT is a single component, silver-filled epoxy for hybrid die and component attach.

EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also available in a frozen syringe.

EPO-TEK® H37MP-2 is a single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging.

A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of MIL-STD 883/Test Method 5011. It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly.

EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.

EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in hybrid and optical industries.

A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.

EPO-TEK® H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications.

A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of EPO-TEK® H61.

A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a lower viscosity version of EPO-TEK® H61.

A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.

EPO-TEK® H62 is a single component, electrically insulating, and thermally conductive epoxy adhesive. It may be used for heat-sinking semiconductor, hybrids, or electronic circuits.