A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications.

EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353ND-T for applications needing decreased flow.

EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T. It was designed for high temperature applications in fiber optics, electronics and medical devices.

EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy.

EPO-TEK® 354-T is a two component, thixotropic, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy and a more thixotropic version of EPO-TEK® 354.

EPO-TEK® 360 is a two component, high-temperature grade epoxy for semiconductor, electronics, fiber optics applications.

EPO-TEK® 360ST is a two component, high-temperature grade, electrically and thermally insulating epoxy. It is a less thixotropic version of EPO-TEK® 360T.

EPO-TEK® 360T is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic paste for non-flow properties.

EPO-TEK® 375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen syringe.

Higher viscosity version of EPO-TEK® 375. Designed for use in fiber optic applications.

EPO-TEK® 377 is a two component, high Tg, fiber optic grade epoxy. It is well suited for semiconductor, medical and optical applications.

EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of EPO-TEK® 377.

EPO-TEK® 383ND is a two component, high temperature, electrically and thermally insulating epoxy. Designed as a longer pot life version of EPO-TEK® 353ND.

A slightly longer pot-life version of EPO-TEK® 353ND. This product meets halogen-free requirements.

A slightly longer pot-life version of EPO-TEK® 353ND. This product easily meets halogen-free requirements.

A single component, electrical and thermally insulating epoxy. Designed as a highly thixotropic, syringe packaged version of EPO-TEK® 383ND.

A single componet, solvent containing, low viscosity polyimide designed for high temperature applications found in semiconductor, hybrid, and optical devices. It is used mostly as a coating and dielectric layer. It can be used at high temperatures.

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized.

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. Higher viscosity version of EPO-TEK® 430.

Two component, slightly thixotropic epoxy suggested for general adhesive bonding, sealing, potting and encapsulation. Replacement for EPO-TEK® 509EBT-M.

EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic industries such as consumer, military, medical and optical/OEM.

A two component, room temperature curing, general and structural grade epoxy resin. It can be used for adhesive and sealing applications in medical, x-ray device, filtration, opto-electronics, and PCB industries. It is a thixotropic, black version of EPO-TEK® 730.

EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive.

A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, x-ray device, filtration, opto-electronics and PCB industries. It is a black version of EPO-TEK 730-110.

EPO-TEK® 730-110 is a two component, room temperature-curing, thermally and electrically insulating epoxy. It can be used for adhesive, sealing, potting or encapsulation applications found in semiconductor, electronics, optical and medical devices.

A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor packaging, electronics, medical, and optical industries. A higher viscosity version of EPO-TEK® 730.

A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. It is a NASA approved, low outgassing epoxy.

EPO-TEK® 920-FL is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920.

A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.

A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. It is a low viscosity version of EPO-TEK® 921.

A two-part thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly.

A two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, optics. It is a lower viscosity and smaller particle size alternative to EPO-TEK® 930.

EPO-TEK® 930-4 is a two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.

A single component, thermally conductive, low halogen, B-Stage epoxy paste.

A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. It can be used as the main gasket seal of glass plates in LCDs or sealing filter windows onto opto-sensors.

A version of EPO-TEK® B9021-1 suggested for improved insulation and LCD gasket sealing.

A single component, thermally conductive, B-Stage epoxy paste.

A single component, electrically and thermally insulating epoxy designed for adhesive, sealing and potting of micro-electronics and semiconductor devices. It can be used in many industries such as military, automotive, optical or medical electronics.

A single component, thermally conductive, electrically insulating epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a low temperature cure and syringe dispensing rheology. It can be used for thermal dissipation when bonding chips, SMDs, PCBs or heat sinks.

A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot-life of several days, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs, PCBs and substrates.