This resin is commonly used for extrusion coating, coextrusion and specialty lamination applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt coating and adhesive, automotive compounding, microcellular crosslinked foam, and molding applications. This product is not intended for use in medical or dental implants.

This resin is suitable for film extrusion and coextrusion with other polymers where superior strength and good heat seal characteristics are required. This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt coating and adhesive, compounding, microcellular crossliked foam, and molding applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for film extrusion applications where low DSC and Vicat are required (eg. Batch inclusion). This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt coating and adhesive, compounding, microcellular crossliked foam, and molding applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for medical packaging and is manufactured to comply with USP Class VI.

This resin is commonly used in wire and cable applications, including jacketing compounds; and for film, including seal layer for flexible packaging. This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt coating and adhesive applications and automotive applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt coating and adhesive applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for medical applications.

This resin is commonly used for extrusion coating, coextrusion, and specialty lamination applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for photovoltaic applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt coating and adhesive applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt coating and adhesive applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt coating and adhesive applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt coating and adhesive applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt coating and adhesive applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for extrusion coating and coextrusion applications where low temperature sealing, superior heat seal bonding and hot tack characteristics are required. This product is not intended for use in medical or dental implants.

This resin is commonly used for photovoltaic and hot melt adhesive applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for hot melt adhesive applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for wire & cable and low initiation temperature heat seal applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for adhesives, sealants, solution coatings and as a gum stock for vulcanized compounds. This product is not intended for use in medical or dental implants.

This resin is commonly used for dental applications and is manufactured to comply with USP Class VI.

This resin is commonly used for wire & cable, low initiation temperature heat seal, and solvent ink formulation applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for low initiation temperature heat seal and solvent ink formulation applications. This product is not intended for use in medical or dental implants.

This resin is commonly used for medical and dental applications and is manufactured to comply with USP Class VI.

This resin is commonly used for pharmaceutical transdermal films and is manufactured to comply with USP Class VI.

This is an experimental Ethylene Vinyl Acetate (EVA) resin designed for filled wire and cable jacketing compounds application. This product is not intended for use in medical or dental implants.

Premium EVA resin designed for wire & cable compounds, tube, sheet and molding applications.

HDPE (high density polyethylene) continuous fiber (uni-directional) reinforced thermoplastic composite tape, 70% E-glass by weight

40% long fiber glass reinforced High Density Polyethylene

60% long strand glass fiber reinforced high density polyethylene

Melt processable HMW-PE powder grade: coarse particle GHR® 8020 ECO-B incorporates >99% of bio-circular ethylene by weight in the finished product through mass balance allocation. The product is a drop-in replacement to the standard grade with the same performance and processing properties and contributes to the displacement of virgin fossil fuel resources. The biobased source and allocated content in the product are certified according to ISCC PLUS mass balance approach.

Melt processable HMW-PE powder grade: coarse particle GHR® 8020  EP ECO-B incorporates >99% of bio-circular ethylene by weight in the finished product through mass balance allocation. The product is a drop-in replacement to the standard grade with the same performance and processing properties and contributes to the displacement of virgin fossil fuel resources. The biobased source and allocated content in the product are certified according to ISCC PLUS mass balance approach. Samples of the above listed GUR® product are tested according to the requirements described in monograph 3.1.3. of Ph.Eur. 10.0 “Polyolefines'. The results of those tests indicated the sampled material was compliant with monograph 3.1.3 of Ph.Eur. 10.0. Please note that the manufacturer or seller of parts and articles made out of the above mentioned products have to take the full responsibility regarding applicable legal requirements.

Coarse particle HMW-PE powder grade; melt processable Samples of the above listed GUR® product are tested according to the requirements described in monograph 3.1.3. of Ph.Eur. 10.0 “Polyolefines'. The results of those tests indicated the sampled material was compliant with monograph 3.1.3 of Ph.Eur. 10.0. Please note that the manufacturer or seller of parts and articles made out of the above mentioned products have to take the full responsibility regarding applicable legal requirements.

Coarse particle HMW-PE powder grade; melt processable

Melt processable HMW-PE powder grade