SUMIKASUPER® E6810KHF
SUMIKASUPER E6810KHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding.
E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C.
E6810KHF is a 50% glass fiber/mineral grade with low warpage, low shrinkage and low anisotropy. E6810KHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, DDR, M2, S-ATA connectors, FPC connectors, and I/O connectors.
E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C.
E6810KHF is a 50% glass fiber/mineral grade with low warpage, low shrinkage and low anisotropy. E6810KHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, DDR, M2, S-ATA connectors, FPC connectors, and I/O connectors.
一般属性
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物料形态
已商用：当前有效
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Contact Information (English)
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Technical Datasheet (Chinese)
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北美洲, 拉丁美洲, 欧洲, 亚太地区
用途
电气/电子应用领域
加工方式
注射成型
其他属性
填料/增强材料, 特性, UL文件号, 外观, 形式, 部件标识代码, 密度 / 比重, 密度, Spiral Flow, 流动方向收缩, 垂直流动方向的收缩, 24小时吸水率, 拉伸模量, 抗张强度, 拉伸应力, 断裂伸长率, 拉伸断裂应变, 弯曲模量, 弯曲模量, 弯曲强度, 弯曲应力, 泊松比, 简支梁无缺口冲击强度, 无缺口悬臂梁冲击, 无缺口伊佐德冲击强度, 洛氏硬度, DTUL (0.45 MPa) 未退火, DTUL (264 psi) - 未退火, DTUL (1.80 MPa) 未退火, 线性热膨胀系数，流动, 线热膨胀系数，垂直, 体积电阻率, 介电强度, 耐电弧性, 漏电起痕指数, 可燃性等级, 干燥温度, 干燥时间, 料筒后部温度, 料筒中部温度, 料筒前部温度, 射嘴温度, 加工（熔体）温度, 模具温度, 注塑压力, 保压, 背压, 螺杆转速
加工
Find specific processing information for SUMIKASUPER® as well as general information for the 液晶聚合物 generic family. 注册 或 登录 了解更多信息。
