STYCAST® A 312
One Component, Fast Curing, Low Viscosity Underfill Encapsulant
STYCAST A 312 is a one component, unfilled, solventless epoxy underfill encapsulant. STYCAST A 312 is a fast curing product with excellent chemical, heat and moisture resistance combined with good dielectric properties.
Application
STYCAST A 312 can be used as capillary flow underfill on CSP & BGA devices. STYCAST A 312 improves the attachment strength of CSP & BGA devices during mechanical stress testing such as drop and bend testing.
STYCAST A 312 is a one component, unfilled, solventless epoxy underfill encapsulant. STYCAST A 312 is a fast curing product with excellent chemical, heat and moisture resistance combined with good dielectric properties.
Application
STYCAST A 312 can be used as capillary flow underfill on CSP & BGA devices. STYCAST A 312 improves the attachment strength of CSP & BGA devices during mechanical stress testing such as drop and bend testing.
一般属性
使用 Prospector 建立免費帳戶時，可造訪 STYCAST® A 312 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
文档
description
Technical Datasheet (English)
下载文档可用性
北美洲, 非洲和中东, 拉丁美洲, 欧洲, 亚太地区
用途
Encapsulant
加工方式
包封
其他属性
特性, 外观, 肖氏硬度, 玻璃转化温度, 线性热膨胀系数，流动, 导热系数, 密度, 粘度, 固化时间, 贮藏期限, Lap Shear Strength
加工
Find specific processing information for STYCAST® as well as general information for the 环氧; 环氧树脂 generic family. 注册 或 登录 了解更多信息。
