CoolPoly® D5522
Thermally conductive LCP for thin wall applications.
CoolPoly® D5522 offers thermal conductivity, excellent mechanical strength, surface appearance, low warpage, and excellent dimensional stability. Application for this grade is for a part with thin wall design in automotive and electronics. The D series is electrically non-conductive and can be used for its dielectric properties.
CoolPoly® D5522 offers thermal conductivity, excellent mechanical strength, surface appearance, low warpage, and excellent dimensional stability. Application for this grade is for a part with thin wall design in automotive and electronics. The D series is electrically non-conductive and can be used for its dielectric properties.
一般属性
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物料形态
已商用：当前有效
文档
可用性
北美洲, 非洲和中东, 拉丁美洲, 欧洲, 亚太地区
加工方式
Lead Free Soldering
多点数据
- Isothermal Stress vs. Strain (ISO 11403)
- Secant Modulus vs. Strain (ISO 11403)
其他属性
添加剂, 特性, 密度, 收缩率, 吸水率23C/50RH, 拉伸模量, 拉伸断裂应力, 拉伸断裂应变, 弯曲模量, 弯曲应力, 简支梁缺口冲击强度, 简支梁无缺口冲击强度, DTUL (1.80 MPa) 未退火, 熔融温度, 线性热膨胀系数，流动, 线热膨胀系数，垂直, 导热系数, 表面电阻率, 体积电阻率, 介电强度, 相对电容率, 耗散因数, 漏电起痕指数, 熔体比热, 其他性能, 干燥温度, 干燥时间, 料筒后部温度, 料筒中部温度, 料筒前部温度, 射嘴温度, 加工（熔体）温度, 模具温度, 注射速度
加工
Find specific processing information for CoolPoly® Thermally Conductive Polymers as well as general information for the 液晶聚合物 generic family. 注册 或 登录 了解更多信息。
