KYOCERA KE-870
Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound.
Strong Points
Application
Strong Points
- High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress.
- Used in Auto Molding System by Rapid Cure Grades.
- KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K).
Application
- Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics.
- Packages for High Heating Volume such as Power Module.
一般属性
使用 Prospector 建立免費帳戶時，可造訪 KYOCERA KE-870 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
文档
可用性
亚太地区
用途
电气/电子应用领域
其他属性
特性, 密度 / 比重, Spiral Flow, 玻璃转化温度, CLTE，流动, 导热系数, Gel Time
加工
Find specific processing information for KYOCERA as well as general information for the 环氧; 环氧树脂 generic family. 注册 或 登录 了解更多信息。
