Ultra Low Outgassing™ SCV1-2599
Ultra low outgassing™ thermally conductive silicone
DESCRIPTION
APPLICATION
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
DESCRIPTION
- Two-part, white, thermally conductive silicone
- Cures with the addition of heat
- 15:1 Mix Ratio (Part A:B)
APPLICATION
- For applications requiring Ultra Low Outgassing™ and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
一般属性
使用 Prospector 建立免費帳戶時，可造訪 Ultra Low Outgassing™ SCV1-2599 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
可用性
北美洲, 非洲和中东, 拉丁美洲, 欧洲, 亚太地区
用途
电气/电子应用领域
其他属性
特性, 机构评级, 外观, 密度 / 比重, 抗张强度, 断裂伸长率, 撕裂强度, 肖氏硬度, CLTE，流动, 导热系数, 体积电阻率, 介电强度, 热固组件, 颜色, 固化时间, 储存稳定性, Lap Shear Strength
加工
Find specific processing information for Ultra Low Outgassing™ as well as general information for the 硅酮 (Silicone) generic family. 注册 或 登录 了解更多信息。
购买地点
您可以從 1 個經銷商或製造商處購買 Ultra Low Outgassing™ SCV1-2599。 注册 或 登录 了解更多信息。
