SUMIKASUPER® E6808UHF
SUMIKASUPER E6808UHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding.
E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C.
E6808UHF is a 40% glass fiber/mineral grade with low warpage, high flowability, and high moldability. E6808UHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micro Board to Board connectors, FPC/FFC fine-pitch connectors, DDR, M2, S-ATA connectors, I/O connectors, and Card connectors.
E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C.
E6808UHF is a 40% glass fiber/mineral grade with low warpage, high flowability, and high moldability. E6808UHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micro Board to Board connectors, FPC/FFC fine-pitch connectors, DDR, M2, S-ATA connectors, I/O connectors, and Card connectors.
一般属性
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物料形态
已商用：当前有效
文档
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北美洲, 拉丁美洲, 欧洲, 亚太地区
用途
电气/电子应用领域
加工方式
注射成型
其他属性
填料/增强材料, 特性, UL文件号, 外观, 形式, 部件标识代码, 密度 / 比重, 密度, Spiral Flow, 流动方向收缩, 垂直流动方向的收缩, 24小时吸水率, 拉伸模量, 抗张强度, 拉伸应力, 断裂伸长率, 拉伸断裂应变, 弯曲模量, 弯曲模量, 弯曲强度, 弯曲应力, 泊松比, 简支梁无缺口冲击强度, 无缺口悬臂梁冲击, 无缺口伊佐德冲击强度, 洛氏硬度, DTUL (66 psi) - 未退火, DTUL (0.45 MPa) 未退火, DTUL (264 psi) - 未退火, DTUL (1.80 MPa) 未退火, 线性热膨胀系数，流动, 线热膨胀系数，垂直, 体积电阻率, 介电强度, 相对电容率, 耗散因数, 耐电弧性, 漏电起痕指数, 可燃性等级, 干燥温度, 干燥时间, 料筒后部温度, 料筒中部温度, 料筒前部温度, 射嘴温度, 加工（熔体）温度, 模具温度, 注塑压力, 保压, 背压, 螺杆转速
加工
Find specific processing information for SUMIKASUPER® as well as general information for the 液晶聚合物 generic family. 注册 或 登录 了解更多信息。
