A single component, solvent containing, low viscosity polyimide designed for high temperature applications found in semiconductor, hybrid, optical, and medical devices. It is used mostly as a coating and dielectric layer. It can be used at high temperatures. It is a REACH compliant version of EPO-TEK OE132.

A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging.

EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.

EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging.

A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400°C seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine print definition, high Tg, low outgassing, and ionic cleanliness are a few of its traits.

EPO-TEK® TV1003 is a single component, screen printable polyimide adhesive designed for semiconductor wafer passivcation applications. It is a more insulating alternative to EPO-TEK® TV1002.

Screen printable polyimide paste for semiconductor wafer coating applications. It is a lower viscosity version of EPO-TEK® TV1003.