Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK-F series is a composite of high performance ceramic filler and 30um thin fiberglass, achieving high thermal conductivity on flat surface with low pressure. Recommended for TO220/TO3P where insulation is needed. Features: Elastomeric compound coated on both sides No oil bleed, long term stability Electrical insulating Applications: Power supplies Automotive electronics Motor controls Power semiconductors

Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK-F series is a composite of high performance ceramic filler and 30um fiberglass, achieving high thermal conductivity on flatness surface with low pressure. Recommended for T0220/TOBP where insulation is needed. Features: Elastomeric compound coated on both sides No oil leakage, long term stability Electrically insulating Applications: Power supplies Automotive electronics Motor contr_ols Power semiconductors

XK-F series is composite of high performance ceramic filler and 30um fiberglass. Achieving high thermal conductivity on flatness surface with low pressure. Recommended using for T0220/TO3P where insulation is needed. Features: Elastomeric compound coated on both sides NO oil bleed, long term stability Electrical insulating Applications: Power supplies Automotive electronics Motor controls Power semiconductors

High thermal conductivity, stability and low oil bleeding improve the heat transferring for high power devices, such as conventional audio amplifier, high speed integrated circuits and central processing unit (CPU) Different from the traditional products, silicone grease BLT can be 50um and below, no liquefaction, curing and chap in applications. Features: Low thermal resistance High thermal performance and stability Environmentally friendly Applications: Computer CPU LED Light

This series of products are resilient and with large deformation suitable for large institutional design tolerances. Single or double layer structure The double layer is reinforced with special ultra thin fabric to increase resistance and workability of puncture, strip type malformation designs Self-adhesive and never recede. No corrosion to the copper surface "enviromentally friendly products". Features: Elastomeric compound coated on both sides NO oil bleed, long term stability Electrical insulating Applications: Telecommunications Computer Between heat-generating semiconductor and a heat sink

This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or double layer structure, the double layer is reinforced with special ultra-thin fabric to increase resistance and workability of puncture, strip type malformation designs. Self-adhesive and never recede. No corrosion to the copper surface, "enviromentally friendly products". Features: Ultra conformable,"gel-like" modulus Designed for low-stress applications low hardness Applications: Telecommunications Computer, Between heat-generating semiconductor and a heat sink

This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or double layer structure, The Double layer is reinforced with special ultra-thin fabric to increase resistance and workability of puncture, strip type malformation designs. Self-adhesive and never recede. No corrosion to the copper surface, "enviromentally friendly products". Features: Ultra conformable,"gel-like" modulus Designed for low-stress applications low hardness Applications: Telecommunications Computer, Between heat-generating

High thermal performance and reliability for irregular surface, excellent flowability and gap filling capacity under low bearing capacity and high compressive load Features: High reliability High compressibility Low bearing capacity

High thermal performance and reliability for irregular surface, excellent flowability and gap filling capacity under low bearing capacity and high compressive load Features: High reliability High compressibility Low bearing capacity

Syringes packaging, automated production, high temperature resistance and 100% thermal curing putty. XK-G series is a silicone based, high performance thermal Gel, filling with a variety of high-performance ceramic powder, possessing the features of high thermal conductivity, insulation, infinite compression. Features: Especially for UAV design Excellent compressibility Low thermal resistance Best for north bridge IC Applications: Consumer electronics/Automotive systems UAV/ Telecommunications Hand-set applications

Syringes packaging, automated production, high temperature, non-corrosive metal, 100% thermal curing putty. XK-G series is a high performance thermal gel , it base on silicone, filled with a variety of high-performance ceramic powder. It has high thermal conductivity, low thermal resistance, good insulation and infinite compression characteristics. Features: Thermal conductivity 6.5W/m.K High compressibility Very low thermal resistance Good creep performance Best for north bridge IC Applications: Consumer electronics Automotive Systems Telecomunications Hand-set applications

Syringes packaging, automated production, high temperature, non-corrosive metal, 100% thermal curing putty. XK-G series is a high performance thermal gel , it base on silicone, filled with a variety of high-performance ceramic powder. It has high thermal conductivity, low thermal resistance, good insulation and infinite compression characteristics. Features: Thermal conductivity 3.0~8.0W/m.K High compressibility Very low thermal resistance Good creep performance Best for north bridge IC Applications: Consumer electronics Automotive Systems Telecomunications Hand-set applications

XK-P110 are highly conformable and very high heat conducting gel www.glpo|y.com in a versatile sheet form. This product is two-sided self-adhesive silicone gel, self-adhesive never recede. No corrosion on the Copper surface. Completely non-toxic and green products accord to international requirements Features: Very high thermal conductivity Ultra-conformable Designed for low-stress applications