LNP THERMOCOMP DF00AIP compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP DF00A8P compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Improved Impact performance, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP DFZ22P compound is based on Polycarbonate (PC) resin containing 10% glass fiber, 10% milled glass. Added features of this grade include: Exceptional Processing.

LNP THERMOCOMP DX05475 compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Flame Retardant.

LNP THERMOCOMP DX05477 compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding, Mold Release, Flame Retardant.

LNP THERMOCOMP DX06094 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Impact, Non- Brominated & Non-Chlorinated Flame Retardant and Mold Release.

LNP THERMOCOMP DX06313 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Impact Modified, Thin-Wall Molding.

LNP THERMOCOMP DX06313I compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Impact Modified, Thin-Wall Molding, Improved Flow.

LNP THERMOCOMP DX06409 compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding, Mold Release, Low Extractables, Healthcare.

LNP THERMOCOMP DX06411 compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding, Mold Release.

LNP THERMOCOMP DX06411H compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding, Mold Release, Healthcare.

LNP THERMOCOMP DX06412H compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Easy Molding, Mold Release and Healthcare.

LNP THERMOCOMP DX07408 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: Flame Retardant.

LNP THERMOCOMP DX09309 compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: High Dielectric Constant.

LNP THERMOCOMP DX09402 compound is based on Polycarbonate (PC) resin containing glass fiber. Added features of this grade include: Low Temperature Ductility, Easy Processing, UV Stabilized, Non-Brominated, Non-Chlorinated Flame Retardant.

LNP THERMOCOMP DX10311 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus and Good Ductility.

LNP THERMOCOMP DX10311X compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus and Good Ductility.

LNP THERMOCOMP DX10313 compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus and High Ductility.

LNP THERMOCOMP DX11354 compound is based on Polycarbonate (PC) resin containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact.

LNP THERMOCOMP DX11354X compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact, Colorable.

LNP THERMOCOMP DX11355 compound is based on Polycarbonate (PC) resin containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact, Non-Brominated, Non-Chlorinated Flame Retardant.

LNP THERMOCOMP DX13006 compound is based on Polycarbonate (PC) resin containing 15% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP DX13354 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact, Good Surface Aesthetics and Wide Processing Window.

LNP THERMOCOMP DX13354X compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact, Good Surface Aesthetics, Wide Processing Window and Colorable.

LNP THERMOCOMP DX14354X compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Flow, Superior Impact, Colorable, Non-Brominated, Non-Chlorinated Flame Retardant.

LNP THERMOCOMP DX15354 compound is based on Polycarbonate (PC) resin containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Heat Resistance.

LNP THERMOCOMP DZ004 compound is based on Polycarbonate (PC) resin containing 20% milled glass.

LNP THERMOCOMP DZ004 compound is based on Polycarbonate (PC) resin containing 20% milled glass.

LNP THERMOCOMP NF001 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 5% glass fiber.

LNP THERMOCOMP NF001 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 5% glass fiber.

LNP THERMOCOMP NF002 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 10% glass fiber.

LNP THERMOCOMP NF002 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 10% glass fiber.

LNP THERMOCOMP NF004 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 20% glass fiber.

LNP THERMOCOMP NX10302 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications.

LNP THERMOCOMP NX11302 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Colorable, Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications.

LNP THERMOCOMP PCA04FRHH compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 20 % glass fiber. Added features of this grade include: Non-Brominated, Non-Chlorinated Flame Retardants.