LNP THERMOCOMP COMPOUND DC0041 is a compound based on Polycarbonate resin containing Carbon Fiber. Added feature of this grade is: Flame Retardant.

LNP THERMOCOMP COMPOUND DC0041PD is a compound based on Polycarbonate resin containing Carbon Fiber. Added feature of this grade is: Flame Retardant.

LNP THERMOCOMP COMPOUND DC0041PE is a compound based on Polycarbonate resin containing Carbon Fiber. Added feature of this grade is: Flame Retardant, PCR content up to 30%

LNP THERMOCOMP DC0041PQ compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Non-Brominated, Non- Chlorinated Flame Retardant, Exceptional Processing.

LNP THERMOCOMP DC0041PR compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Non-Brominated, Non-Chlorinated Flame Retardant, PCR content up to 30%.

LNP THERMOCOMP COMPOUND DC0041PZ is a compound based on Polycarbonate resin containing Carbon Fiber. Added feature of this grade is: Flame Retardant, PCR content up to 30%

LNP THERMOCOMP DC0041XX5 compound is based on PC Copolymer Resin containing 20% carbon fiber suitable for injection molding applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength. This halogen-free flame retardant resin is EN45545 R6 HL3 compliant and is targeted for train interior applications (category R6).

LNP THERMOCOMP DC0049XF compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant.

LNP THERMOCOMP DC004E compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

LNP THERMOCOMP COMPOUND DC0051 is a compound based on Polycarbonate resin containing >20% Carbon Fiber. Added feature of this grade is: Flame Retardant

LNP THERMOCOMP DC006 compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP DC006ER compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding, Mold Release, Electrically Conductive.

LNP THERMOCOMP DC006ERH compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding, Mold Release, Healthcare.

LNP THERMOCOMP DF002 compound is based on Polycarbonate (PC) resin containing 10% glass fiber.

LNP THERMOCOMP DF0029P compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Exceptional Processing. Flame Retardant.

LNP THERMOCOMP DF002ER compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding. Mold Release

LNP THERMOCOMP DF002ER compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding. Mold Release

LNP THERMOCOMP DF002ERH compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding, Healthcare, Mold Release.

LNP THERMOCOMP DF002FV compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Good Surface Aesthetics and Wide Processing Window.

LNP THERMOCOMP DF002FVQ compound is based on Polycarbonate (PC) resin containing 10% glass fiber and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Good Adhesion Strength, UL94 V0@0.8mm (black).

LNP THERMOCOMP DF002H compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP DF003E compound is based on Polycarbonate (PC) resin containing 15% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP DF004 compound is based on Polycarbonate (PC) resin containing 20% glass fiber.

LNP THERMOCOMP DF004 compound is based on Polycarbonate (PC) resin containing 20% glass fiber.

LNP THERMOCOMP DF004 compound is based on Polycarbonate (PC) resin containing 20% glass fiber.

LNP THERMOCOMP DF0041VI compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Non-Brominated, Non-Chlorinated Flame Retardant, Wide Processing Window.

LNP THERMOCOMP DF0046P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP DF0049 compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Flame Retardant.

LNP THERMOCOMP DF0049P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing, Flame Retardant.

LNP THERMOCOMP DF004AT compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Transparent/Translucent, High stiffness/Strength

LNP THERMOCOMP DF004AXC compound is based on Polycarbonate (PC) resin containing 20% glass fiber.

LNP THERMOCOMP DF004ER compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding, Mold Release.

LNP THERMOCOMP DF004EXP compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP DF004P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing.

LNP THERMOCOMP DF004P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing.

LNP THERMOCOMP DF004RXP compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Mold Release.

LNP THERMOCOMP DF004XXC compound is based on Polycarbonate (PC) resin containing 20% glass fiber.

LNP THERMOCOMP DF005 compound is based on Polycarbonate (PC) resin containing 25% glass fiber.

LNP THERMOCOMP DF006 compound is based on Polycarbonate (PC) resin containing 30% glass fiber.

LNP THERMOCOMP DF0061VI compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Non-Brominated, Non-Chlorinated Flame Retardant, Wide Processing Window.