Prospector®

Polyamide (Nylon) by サビック

製品 可用性 製品の説明
LNP™ THERMOCOMP™ Compound RX99732C アジア太平洋地域
LNP THERMOCOMP RX99732C compound is based on Nylon 6/6 resin containing 45% glass fibers.
LNP™ THERMOCOMP™ Compound RYY33 アジア太平洋地域
LNP THERMOCOMP RYY33 compound is based on Nylon 6/6 resin containing 33% glass fiber.
LNP™ THERMOCOMP™ Compound RZ006 アジア太平洋地域
LNP THERMOCOMP RZ006 compound is based on Nylon 6/6 resin containing 30% milled glass.
LNP™ THERMOCOMP™ Compound RZ0069 アジア太平洋地域
LNP THERMOCOMP RZ0069 compound is based on Nylon 6/6 resin containing 30% milled glass. Added features of this grade include: Flame Retardant.
LNP™ THERMOCOMP™ Compound RZ006S アジア太平洋地域
LNP THERMOCOMP RZ006S compound is based on Nylon 6/6 resin containing 30% milled glass. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound RZ006SXP アジア太平洋地域
LNP THERMOCOMP RZ006SXP compound is based on Nylon 6/6 resin containing 30% milled glass. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound SC004 アジア太平洋地域
LNP THERMOCOMP SC004 compound is based on Nylon 12 resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
LNP™ THERMOCOMP™ Compound SF006 アジア太平洋地域
LNP THERMOCOMP SF006 compound is based on Nylon 12 resin containing 30% glass fiber.
LNP™ THERMOCOMP™ Compound SF008 アジア太平洋地域
LNP THERMOCOMP SF008 is a compound based on Nylon 12 resin containing 40% Glass Fiber.
LNP™ THERMOCOMP™ Compound SF00A アジア太平洋地域
LNP THERMOCOMP SF00A compound is based on Nylon 12 resin containing 50% glass fiber.
LNP™ THERMOCOMP™ Compound UC006H アジア太平洋地域
LNP THERMOCOMP UC006H compound is based on Polyphthalamide (PPA) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Healthcare.
LNP™ THERMOCOMP™ Compound UC008H アジア太平洋地域
LNP THERMOCOMP UC008H compound is based on Polyphthalamide (PPA) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Healthcare.
LNP™ THERMOCOMP™ Compound UF003AS アジア太平洋地域
LNP THERMOCOMP UF003AS compound is based on Polyphthalamide (PPA) resin containing 15% glass fiber. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound UF004AS アジア太平洋地域
LNP THERMOCOMP UF004AS compound is based on Polyphthalamide (PPA) resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound UF0067V アジア太平洋地域
LNP THERMOCOMP UF0067V compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, High Heat Resistance, SMT Process capable, Non-Brominated, Non-Chlorinated Flame Retardant.
LNP™ THERMOCOMP™ Compound UF0067W アジア太平洋地域
LNP THERMOCOMP UF0067W compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Hot Water Moldable, Non-Brominated & Non-Chlorinated Flame Retardant.
LNP™ THERMOCOMP™ Compound UF0069S アジア太平洋地域
LNP THERMOCOMP UF0069S compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.
LNP™ THERMOCOMP™ Compound UF006AS アジア太平洋地域
LNP THERMOCOMP UF006AS compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound UF006H アジア太平洋地域
LNP THERMOCOMP UF006H compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Healthcare.
LNP™ THERMOCOMP™ Compound UF007SXC アジア太平洋地域
LNP THERMOCOMP UF007SXC compound is based on Polyphthalamide (PPA) resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound UF008AR アジア太平洋地域
LNP THERMOCOMP UF008AR compound is based on Polyphthalamide (PPA) resin, containing 40% glass fiber. Added features of this grade include: Mold Release.
LNP™ THERMOCOMP™ Compound UF008AS アジア太平洋地域
LNP THERMOCOMP UF008AS compound is based on Polyphthalamide (PPA) resin containing 40% glass fiber. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound UF008H アジア太平洋地域
LNP THERMOCOMP UF008H compound is based on Polyphthalamide (PPA) resin containing 40% glass fiber. Added features of this grade include: Healthcare.
LNP™ THERMOCOMP™ Compound UF009S アジア太平洋地域
LNP THERMOCOMP UF009S compound is based on Polyphthalamide (PPA) resin containing 45% glass fiber. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound UF00AAS アジア太平洋地域
LNP THERMOCOMP UF00AAS compound is based on Polyphthalamide (PPA) resin containing 50% glass fiber. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound UF00ASW アジア太平洋地域
LNP THERMOCOMP UF00ASW compound is based on Polyphthalamide (PPA) resin containing 50% glass fiber. Added features of this grade include: Heat Stabilized, Hot Water Moldable.
LNP™ THERMOCOMP™ Compound UF00BAS アジア太平洋地域
LNP THERMOCOMP UF00BAS compound is based on Polyphthalamide (PPA) resin containing 55% glass fiber. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound UFW49RSC アジア太平洋地域
LNP THERMOCOMP UFW49RSC compound is based on Polyphthalamide (PPA) resin containing 45% glass fiber, 20% Wollastonite. Added features of this grade include: Heat Stabilized.
LNP™ THERMOCOMP™ Compound UX04509H アジア太平洋地域
LNP THERMOCOMP UX04509H compound is based on Polyphthalamide (PPA) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Healthcare.
LNP™ THERMOCOMP™ Compound UX06028 アジア太平洋地域
LNP THERMOCOMP UX06028 compound is based on Polyphthalamide (PPA) resin containing 40% glass fiber. Added features of this grade include: Mold Release.
LNP™ THERMOCOMP™ Compound UX06032 アジア太平洋地域
LNP THERMOCOMP UX06032 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Non-Brominated & Non-Chlorinated Flame Retardant, Heat Stabilized.
LNP™ THERMOCOMP™ Compound UX08319 アジア太平洋地域
LNP THERMOCOMP UX08319 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Dielectric Properties.
LNP™ THERMOCOMP™ Compound UX08325 アジア太平洋地域
LNP THERMOCOMP UX08325 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, SMT Process capable.
LNP™ THERMOCOMP™ Compound VF008A アジア太平洋地域
LNP THERMOCOMP VF008A compound is based on super tough Nylon 66 resin containing 40% glass fiber.
LNP™ THERMOCOMP™ Compound XF006S アジア太平洋地域
LNP THERMOCOMP XF006S compound is based on Amorphous Nylon resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
LNP™ THERMOTUF™ Compound IX02582 - Americas ラテンアメリカ
LNP THERMOTUF IX02582 compound is based on Nylon 6/12 resin containing 40% glass fiber. Added features of this grade include: Impact Modified.
LNP™ THERMOTUF™ Compound IX02582 - Asia アジア太平洋地域
LNP THERMOTUF IX02582 compound is based on Nylon 6/12 resin containing 40% glass fiber. Added features of this grade include: Impact Modified.
LNP™ THERMOTUF™ Compound PF003IU アジア太平洋地域
LNP THEMROTUF PF003IU compound is based on Nylon 6 resin containing 15% glass fiber. Added features of this grade include: Impact Modified and UV Stabilized.
LNP™ THERMOTUF™ Compound PF006I アジア太平洋地域
LNP THERMOTUF PF006I compound is based on Nylon 6 resin containing 30% glass fiber. Added features of this grade include: Impact Modified.
LNP™ THERMOTUF™ Compound PF008IR アジア太平洋地域
LNP THERMOTUF PF008IR compound is based on Nylon 6 resin containing 40% glass fiber. Added features of this grade include: Impact Modified, Mold Release.