Polyamide (Nylon) by BB Resins S.r.l.
製品 | 可用性 | 製品の説明 |
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BB-AMIDE 5002 X 70 | アジア太平洋地域 |
BB-AMIDE 5002 X 70 is a polyamide resin in solution suitable for formulating solvent and high solids systems in coating field.
Being a polyamide based on fatty acids, it is useful for the formulation of anticorrosive systems, industrial maintenance and enamel paints.
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BB-AMIDE 5005 | アジア太平洋地域 |
BB-AMIDE 5005 is a polyamide/epoxy adduct in solution, reactive at room temperature with solid epoxy resins to be used for formulating solvent systems.
BB-AMIDE 5005, in comparison with standard polyamide resins, has the advantage not to need of normal induction time after catalysis and not to hardener under critical temperatures and moisture.
BB-AMIDE 5005 is useful for formulating anticorrosive systems, industrial maintenance and enamel paints.
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BB-AMIDE 5006 | アジア太平洋地域 |
BB-AMIDE 5006 is a polyamide/epoxy adduct in solution, reactive at room temperature with solid epoxy resins to be used for formulating solvent systems.
BB-AMIDE 5006, in comparison with standard polyamide resins, has the advantage not to need of normal induction time after catalysis and not to hardener under critical temperatures and moisture.
BB-AMIDE 5006 is useful for formulating anticorrosive systems, industrial maintenance and enamel paint.
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BB-AMIDE 5011 | アジア太平洋地域 |
BB-AMIDE 5011 is a low viscosity polyamido-imidazoline resin.
The main characteristics of BB-AMIDE 5011 are:
- short pot-life
- low viscosity
- good compatibility with epoxy resins
BB-AMIDE 5011 is useful for formulating floorings, castings, electrical encapsulation and adhesive for wood field.
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BB-AMIDE 5012 | アジア太平洋地域 |
BB-AMIDE 5012 is a low viscosity polyamido-imidazoline resin.
The main characteristics of BB-AMIDE 5012 are:
- long pot-life
- low viscosity
- good compatibility with epoxy resins
BB-AMIDE 5012 is useful for formulating floorings,castings, electrical encapsulation and adhesive for wood field.
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BB-AMIDE 5033 | アジア太平洋地域 |
BB-AMIDE 5033 is a medium low viscosity reactive polyamide resin.
This resin is designed for use with solid or liquid epoxy resins to give tough, chemical resistant thermoset coatings with room temperature cure.
BB-AMIDE 3033/epoxy resin systems are used in maintenance coatings, and high solids enamel paint formulations.
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BB-AMIDE 5036 | アジア太平洋地域 |
BB-AMIDE 5036 a high viscosity reactive polyamide resin.
This product is designed for use with solid or liquid epoxy resins to give tough, chemical resistance, thermoset coatings using room temperature cure.
BB-AMIDE 5036/epoxy resins systems are used in maintenance coatings and high solids formulations.
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BB-AMIDE 5037 | アジア太平洋地域 |
BB-AMIDE 5037 is a medium reactive epoxypolyamide adduct suitable for formulating solvent-free and high solids systems showing very good curing characteristics under critical conditions (humidity and low temperature).
BB- AMIDE 5037 shows good flexibility and adhesion when used in combination with liquid epoxy resin.
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