Polyamide (Nylon): PPA
製品 | 可用性 | 製品の説明 |
---|---|---|
ESD 4085 HS (ISO) | アジア太平洋地域 |
Carbon Fiber - Electrically Conductive - Heat Stabilized
|
ESD 4086 (ISO) | アジア太平洋地域 |
Carbon Fiber - Electrically Conductive
|
ESD 4091 (ISO) | アジア太平洋地域 |
Carbon Fiber - Electrically Conductive - EMI/RFI Shielding - Preliminary Datasheet
|
ForTii® Ace JTX8 | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Electro-friendly, Improved resistance to blistering during reflow - soldering process, Improved color stability
ForTii® Ace JTX8 is the only polyamide grade in the world that secures, in all product designs, the JEDEC MSL 1 rating at all thicknesses. Ace JTX8 has the highest Tg available in polyamides (160°C) to satisfy various industry requirements like chemical resistance and high temperature thermal ageing. Ace JTX8 has extremely robust processing performance and allows 100% regrinding with high mechanical properties retention.
|
ForTii® Ace MX53B | アジア太平洋地域 |
50% Glass Reinforced, PA4T, Heat Stabilized, for Structural Parts
ForTii® Ace MX53B is a high Tg PPA combining good toughness at low temperatures and chemical resistance. It is designed to replace metal in structural parts that need high performance over a broad temperature range, from -35°C to above 150°C, both in dry as well as conditioned environment.
|
ForTii® Ace MX54B | アジア太平洋地域 |
60% Glass Reinforced, PA4T, Heat Stabilized, for Structural Parts
ForTii® Ace MX54B is a high Tg PPA combining good toughness at low temperatures and chemical resistance. It is designed to have a dimensional stability close to aluminum. It has a high mechanical performance over a broad temperature range, from -35°C to above 150°C, both in dry as well as conditioned environment.
|
ForTii® Ace WX51-FC | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Food Contact Quality, Drinking Water Grade
ForTii® Ace WX51-FC has best in class high temperature and wet mechanical performance, weldline strength and weldline strength retention in hot water and steam. For detailed statements and information regarding food contact and water contact approvals please contact your Envalior representative.
|
ForTii® C11-F | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous
ForTii® C11-F is developed for low corrosion and has good balance in flow, toughness and stiffness, enabling thin walls or complicated geometries for E&E applications. C11-F has an all color V0 rating down 0.2mm and high RTI electrical rating of 140°C at 0.75 mm and a CTI of 800V to secure thermal ageing and electrical performance.
|
ForTii® Care P1G6 | アジア太平洋地域 |
30% Glass Reinforced, High Performance PPA, Medical grade
|
ForTii® Eco E11 | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Good Flow, Halogen free and free of red phosphorous, Certified V-0 at 0.15mm
ForTii® Eco E11 has an excellent balance in flow, toughness and stiffness with superior processing performance for injection molding. It has improved toughness and is suitable for SMT processes. Eco E11 has a high electrical RTI rating of 150°C at 0.75 mm and has CTI 600V. Eco E11 is Eco-friendly due to its partly bio-based content.
Design Challenge
Life cycle assessment
|
ForTii® F11 | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous, Certified V-0 at 0.2mm
ForTii® F11 has an excellent balance in flow, toughness and stiffness, enabling thin walls or complicated geometries for E&E applications. F11 is all-color VDE approved, has a high RTI electrical rating of 140°C at 0.75 mm and a CTI =800V rating to secure thermal ageing and electrical performance.
|
ForTii® F12 | アジア太平洋地域 |
40% Glass Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous
ForTii® F12 has excellent balance of stiffness and toughness, suitable for high mechanical loaded application such as power connector or EV parts. F12 has high RTI electrical rating of 140°C at 0.75 mm and shows JEDEC Level 2 performance, enabling SMT process without deformation and low risk on blistering.
|
ForTii® JTX2 | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Electro-friendly
ForTii® JTX2 has robust mechanical performance and has good reliability in thermal ageing and mechanical shocks. JTX2 has consistent performance in injection molding processing and a low risk of blistering due to its JEDEC MLS 1 rating for specified thicknesses. JTX2 is the best candidate for HB reflow headers/connectors in (automotive) electronics.
|
ForTii® K11 | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Good Flow, Electro-friendly
ForTii® K11 combines excellent mechanical properties with low warpage for miniature applications such as Audio Jack and Camera Holder.
|
ForTii® K12 | アジア太平洋地域 |
40% Glass Reinforced, PA4T, Electro-friendly
ForTii® K12 combines high mechanical strength and good flowability, ideal for designs requiring dimensional stability and impact resistance. K12 is suitable for applications such as sensor housing or camera bracket.
|
ForTii® LDS51B | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Halogen free and free of red phosphorous, Certified V-0 at 0.4mm, Laser Direct Structuring (LDS)
ForTii® LDS51B is a truly reflow compatible and halogen-free flame retardancy grade. LDS51B has superior plating performance and is compatible with a broad range of laser settings enabling high resolution and fine line capability.
|
ForTii® LDS85B | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Laser Direct Structuring (LDS)
ForTii® LDS85B enables mechanical function integration with high impact resistance and ductility. LDS85B has very good plating performance.
|
ForTii® MX15HR | アジア太平洋地域 |
35% Glass Reinforced, PA4T, Electro-friendly, Enhanced Hydrolytic Stability, for Automotive applications
ForTii® MX15HR exhibits enhanced hydrolytic stability towards aggressive coolants (water/glycol, 135°C) that are used in engine's thermal management systems. It has excellent mechanical performance and weld-line resistance.
|
ForTii® MX2 | アジア太平洋地域 |
40% Glass Reinforced, PA4T, Heat Stabilized, for Automotive applications
ForTii® MX2 is a high Tg PPA that outperforms in dimensional stability at elevated temperatures due to the high heat deflection temperature (HDT). MX2 has excellent fatigue performance and good chemical resistance.
Design Challenge
Designing structural parts | CAE
Designing structural parts | high strength and stiffness solutions
|
ForTii® MX3 | アジア太平洋地域 |
50% Glass Reinforced, PA4T, Heat Stabilized, for Automotive applications
ForTii® MX3 is a high Tg PPA that outperforms in dimensional stability at elevated temperatures due to the high heat deflection temperature (HDT). MX3 has excellent fatigue performance and good chemical resistance.
Design Challenge
Designing structural parts | CAE
Designing structural parts | high strength and stiffness solutions
|
ForTii® NMX33 | アジア太平洋地域 |
50% Glass Reinforced, PA4T, Suitable for NMT, Suitable for PVD
ForTii® NMX33 offers excellent adhesion to NMT treated metals and high mechanical performance in metal/plastics bonding. NMX33 also has a high HDT resulting in a good thermal resistance, supporting high temperature secondary processes such as high temperature PVD.
|
ForTii® T11 | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous, Certified V-0 at 0.2mm
ForTii® T11 has optimal toughness and is the best solution for (automotive) electrical components in harsh environments to minimize the risk of cracking and to provide design freedom and product reliability in terms of thermal shock ageing >1000 cycles. T11 passes JEDEC MSL 1 reflow performance (for specified thickness), reaches CTI =800V for heavy duty components, is all-color VDE approved and has electrical RTI rating of 140°C at 0,75 mm.
|
ForTii® TX1 | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous, Certified V-0 at 0.35mm
ForTii® TX1 has robust mechanical & JEDEC Level 2 performance, enabling SMT process without deformation and low risk on blistering. TX1 has stable processing behavior and is suitable for typical consumer electronics connector manufacturing such as I/O, FPC and WTB connectors.
|
ForTii® WX11-FC | アジア太平洋地域 |
30% Glass Reinforced, PA4T, Food Contact Quality, Drinking Water Grade
ForTii® WX11-FC has excellent hydrolysis resistance, processability and surface quality and is ideal for complex and thin walled food and water contact applications. For detailed statements and information regarding food contact and water contact approvals please contact your Envalior representative.
|
ForTii® WX12-FC | アジア太平洋地域 |
40% Glass Reinforced, PA4T, Food Contact Quality, Drinking Water Grade
ForTii® WX12-FC has excellent hydrolysis resistance, processability and surface quality and is ideal for complex and thin walled food and water contact applications. For detailed statements and information regarding food contact and water contact approvals please contact your Envalior representative.
|
Frianyl® XT4 GF30 V0I BK 9005/CC | アジア太平洋地域 |
PPA compound, 30% glass fiber reinforced, heat stabilized, halogens free. UL listed V0@0,4mm.
Specifically designed for electrical and electronic applications that require high thermal, peak and continuous resistance together with compliance with the most stringent safety requirements, this compound is also easy to process with excellent aesthetic results. Suitable for components that need to withstand the reflow soldering process (SMT).
|
Frianyl® XT4 GF30 V0I BK 9005/D | アジア太平洋地域 |
PPA compound, 30% glass fiber reinforced, heat stabilized, halogens free. UL listed V0@0,4mm.
Specifically designed for electrical and electronic applications that require high thermal, peak and continuous resistance together with compliance with the most stringent safety requirements. Suitable for components that need to withstand the reflow soldering process (SMT).
|
Frianyl® XT4 GF30 V0I NC 1102/F | アジア太平洋地域 |
PPA compound, 30% glass fiber reinforced, heat stabilized, halogens free. UL listed V0@0,4mm.
Specifically designed for electrical and electronic applications that require high thermal, peak and continuous resistance together with compliance with the most stringent safety requirements. Suitable for components that need to withstand the reflow soldering process (SMT).
|
Frianyl® XT4 GF30 V0I | アジア太平洋地域 |
PPA compound, 30% glass fiber reinforced, heat stabilized, halogens free. UL listed V0@0,4mm.
Specifically designed for electrical and electronic applications that require high thermal, peak and continuous resistance together with compliance with the most stringent safety requirements, this compound is also easy to process with excellent aesthetic results. Suitable for components that need to withstand the reflow soldering process (SMT).
|
Generic PPA - Carbon Fiber | アジア太平洋地域 |
This data represents typical values that have been calculated from all products classified as: Generic PPA - Carbon Fiber
This information is provided for comparative purposes only.
|
Generic PPA - Glass Fiber | アジア太平洋地域 |
This data represents typical values that have been calculated from all products classified as: Generic PPA - Glass Fiber
This information is provided for comparative purposes only.
|
Generic PPA - Mineral | アジア太平洋地域 |
This data represents typical values that have been calculated from all products classified as: Generic PPA - Mineral
This information is provided for comparative purposes only.
|
Generic PPA - PTFE | アジア太平洋地域 |
This data represents typical values that have been calculated from all products classified as: Generic PPA - PTFE
This information is provided for comparative purposes only.
|
Generic PPA | アジア太平洋地域 |
This data represents typical values that have been calculated from all products classified as: Generic PPA
This information is provided for comparative purposes only.
|
GITOP© AN4920SN FWB50 | アジア太平洋地域 | |
GITOP© G362 A01 | アジア太平洋地域 | |
GITOP© G382 A01 | アジア太平洋地域 | |
GITOP© G392 A01 | アジア太平洋地域 | |
GITOP© G3A2 A01 | アジア太平洋地域 | |
GITOP© G3A2 N03U | アジア太平洋地域 |