A lower viscosity version of EPO-TEK® T6065. It can be used for simiconductor die attach, SMD bonding, and general heat sinking for hybrid micro-electronic assembilies and packages.

A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.

EPO-TEK® T6067-3 is a single component thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. It is a lower viscosity version of EPO-TEK® T6067.

A single component, electrically insulating, low stress die attach epoxy designed for extended pot-life with fast curing techniques. It can be used for JEDEC level semiconductor packaging. Lead-frames loaded into magazines can be fast-cured inside traditional box ovens. Snap curing up 200°C-220°C may be realized. Replacement for EPO-TEK® T6116-R2.

A two component, thermally conductive, electrically insulating epoxy designed for chip bonding in semiconductor, microelectronic, optoelectronics, and general electronic assembly applications. It can be used at the chip or PCB packaging level interconnect. Some features include low temperature curing, long pot-life and dielectric properties.

EPO-TEK® T7109 is a two component, thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, medical and optical industries.

EPO-TEK® T7109-17 is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries. It is a replacement for EPO-TEK® T7109-14.

A flexible, electrically insulating epoxy paste designed for low stress and heat dissipation applications. Alternative to EPO-TEK® T7109-17.

EPO-TEK® T7109-19 is a two component, flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is a lower outgassing version of EPO-TEK® T7109-17 with similar thermal management.

Flexible thermally conductive epoxy. A more flexible version of EPO-TEK® T7109-19.

EPO-TEK® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.

Two component thermally conductive epoxy used for potting and encapsulating.

A two component, electrically insulating, low stress die attach epoxy designed for extended pot-life with fast curing techniques. It can be used for JEDEC level semiconductor packaging. Lead-frames loaded into magazines can be fast-cured inside traditional box ovens. Snap curing up 200°C-220°C may be realized. Replacement for EPO-TEK® T6116-R2.

EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.

Thermally conductive, electrically insulating epoxy suggested for general adhesive bonding, sealing, potting and encapsulation. Replacement for EPO-TEK® T905 Black.

Two component, thermally conductive, electrically insulating epoxy suggested for general adhesive bonding, sealing, potting and encapsulation applications. Replacement for EPO-TEK® T905.

EPO-TEK® T905BN-3 is a thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation.

EPO-TEK® T905BN-4 is a two component, room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications

EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.

EPO-TEK® TD1001-67 is a soft single component, thermally conductive, electrically insulating epoxy. It is a more compliant version of EPO-TEK® TD1001.

Longer pot-life version of EPO-TEK® T7109, thermally conductive, electrically insulating epoxy for heat sinking applications.

Single component, thermally conductive, electrically insulating epoxy containing 2 mil glass beads for bond-line control in adhesive and sealing applications. It is the replacement for EPO-TEK® TH106-4.

Single component, thermally conductive for semiconductor and microelectric assembly. It is designed for superior wetting and adhesion strength to gold hybrid circuit substrates and packaging materials. It is a replacement for EPO-TEK® TH106.

EPO-TEK® TJ1104-LH is a black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.

A two component, low-halogen, electrically insulating die attach adhesive with long pot life.

EPO-TEK® TJ2139-LH is a two component, electrically insulating epoxy adhesive designed to meet low halogen standards.

A two component, low-halogen, electrically insulating die attach adhesive with extended pot life.

Longer pot-life version of EPO-TEK® T7109, thermally conductive, electrically insulating epoxy for heat sinking applications.

EPO-TEK® TV2001 is a two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits. It is particularly suitable for bonding ferrite cores in power device plastic packaging. Excellent adhesion to PCBs, ceramics, most metals and lead-frames. Also available in a frozen syringe.

EPO-TEK® TZ101 is a single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. Also available in a frozen syringe.

A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy (http://outgassing.nasa.gov) suitable for electronic applications such as smart cards, RFIDs, medical implants and wafer level camera optics.

EPO-TEK® UD1214 is optically opaque epoxy, which can be cured by UV, UV plus thermal or heat only. It is especially designed for UV fast cure and following low temperature (<80C) curing for shadow areas. It can be used as adhesive, sealing, and encapsulation in semiconductor, electro-optics, fiber optics, circuit assembly, medical and scientific/OEM industries for blocking out light in opto-packages.

Optically clear UV curable adhesive and encapsulant designed to resist discoloration during solder reflow processing.

EPO-TEK® UD1824 is single componet, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

A single component, low viscosity UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectric packaging application.

EPO-TEK® UJ1190 is a clear, UV curable adhesive.