Protection against oxygen-infused plasma is key in many etch chamber environments. These harsh environments often break down non-resistant materials, causing harmful particulation and, ultimately, defective chips.

Greene Tweed’s Chemraz ® XPE is highly resistant to O2 plasma and can be used in a wide range of applications, such as slit valve doors, reaction chamber lid seals, and gate valve seals. This advanced elastomeric material offers the semiconductor and solar industry an alternative to legacy products that quickly erode in the oxygen environment. With excellent resistance to both O2 and CF4 plasmas, this material affords an increased chip yield and maximized production. In addition, XPE seals provide customers with an increased MTBR (mean time between repair) to reduce downtime and maintenance costs.