Chemraz ® 629 FFKM is specifically developed by Greene Tweed to meet the rigorous demands of aggressive plasma systems. Its unique formulation provides enhanced plasma resistance in oxygen and fluorine plasma processes, resulting in minimal contamination, less downtime, and higher wafer processing yields.

Chemraz ® 629 is developed from an advanced polymer using fluoro-polymer nano-composite technology particles. Recommended for both static and dynamic dry wafer processing applications such as etch, remote plasma cleans, and deposition (CVD, HDPCVD) with challenging gland designs and reduced sealing loads, it remains stable at service temps to 500°F (260°C).