SUMIKASUPER E6808LHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6808LHF is a 40% glass fiber/mineral grade with high strength, low warpage and dimensional accuracy. E6808LHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, floating connectors, flexible printed circuit (FPC) connectors, and I/O connectors.

SUMIKASUPER E6808UHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6808UHF is a 40% glass fiber/mineral grade with low warpage, high flowability, and high moldability. E6808UHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micro Board to Board connectors, FPC/FFC fine-pitch connectors, DDR, M2, S-ATA connectors, I/O connectors, and Card connectors.

SUMIKASUPER E6809T is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6809T is a 45% mineral grade with high heat resistance and high surface smoothness. E6809T is used for injection molding various connectors, relay parts, coil seals, bobbins, and office printer and automotive parts, plus heat-resistant cookware.

SUMIKASUPER E6809U is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000 series which is general-purpose grades are distinguished by their high heat resistance and strength, good moldability and ability to hold tight tolerances, low mold shrinkage, and good mold release. E6000 Series grades are typically processed at 360°C. E6809U is a 45% glass fiber/mineral grade with high heat resistance, good moldability and low warpage. E6809U is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for DDR, M2 and S-ATA connectors, FPC/FFC connectors, and I/O connectors.

SUMIKASUPER E6810KHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6810KHF is a 50% glass fiber/mineral grade with low warpage, low shrinkage and low anisotropy. E6810KHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, DDR, M2, S-ATA connectors, FPC connectors, and I/O connectors.

SUMIKASUPER E6810LHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C. E6810LHF is a 50% glass fiber/mineral grade with low warpage, low shrinkage and low anisotropy. E6810LHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, floating connectors, flexible printed circuit (FPC) connectors, and I/O connectors.

SUMIKASUPER SR1009 is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SR1000 series are distinguished by their high heat resistance, ultrahigh flow, moldability, and low warpage. They also provide high heat resistance to withstand reflow soldering. SR1000 series are typically processed at 360°C. SR1009 is a 45% glass fiber grade with low warpage, good flowability, thin-wall ultra-high strength, and high hardness. SR1009 is used for injection various connectors, relay parts, coil seals, bobbins. It is the recommended grade for FPC connectors for Actuators, Board to Board connectors.

SUMIKASUPER SR1009L is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SR1000 series are distinguished by their high heat resistance, ultrahigh flow, moldability, and low warpage. They also provide high heat resistance to withstand reflow soldering. SR1000 series are typically processed at 360°C. SR1009L is a 45% glass fiber grade with low warpage, thin-wall ultra-high strength, and high hardness. SR1009L is used for injection various connectors, relay parts, coil seals, bobbins. It is the recommended grade for FPC connectors for Actuators, Board to Board connectors.

SUMIKASUPER SR1205L is a Liquid Crystal Polymer (LCP) product filled with glass fiber/inorganic. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SR1000 series are distinguished by their high heat resistance, ultrahigh flow, moldability, and low warpage. They also provide high heat resistance to withstand reflow soldering. SR1000 series are typically processed at 360°C. SR1205L is a 25% glass fiber/inorganic filler grade with low warpage, high strength, low relative permittivity and low dielectric dissipation factor. SR1205L is used for injection various connectors, relay parts, coil seals, bobbins. It is the recommended grade for High-frequency connectors, mezzanine connectors and backplane connectors.

SUMIKASUPER SR2506 is a Liquid Crystal Polymer (LCP) product filled with glass fiber&mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SR2000 series are distinguished by their high heat resistance, ultrahigh flow, moldability, and low warpage. They also provide high heat resistance to withstand reflow soldering. SR2000 series are typically processed at 350°C. SR2506 is a 30% glass fiber/mineral grade with low warpage, thin-wall ultra-high flowability and high thin-wall strength. SR2506 is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micor Board to Board connectors, FPC/FFC fine-pitch connectors and Card connectors.

SUMIKASUPER SR2507 is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SR2000 series are distinguished by their high heat resistance, ultrahigh flow, moldability, and low warpage. They also provide high heat resistance to withstand reflow soldering. SR2000 series are typically processed at 350°C. SR2507 is a 35% mineral grade with urtra-low warpage, thin-wall ultra-high flowability, and surface smoothness. SR2507 is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micor Board to Board connectors, FPC/FFC fine-pitch connectors and Card connectors.

SUMIKASUPER SV6808GHF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SV6000 Series are used for injection molded connectors (including board-to-board (B2B) fine-pitch connectors, flexible printed circuit (FPC) fine-pitch connectors, and memory connectors), Card connectors and thin-wall connectors, as well as CPU sockets. SV6808GHF is a 40% glass fiber/mineral grade with low warpage, high flowability and thin wall strength. SV6808GHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micro Board to Board connectors, FPC/FFC fine-pitch connectors, DDR, M2, S-ATA connectors, I/O connectors, and Card connectors.

SUMIKASUPER SV6808L is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SV6000 Series are used for injection molded connectors (including board-to-board (B2B) fine-pitch connectors, flexible printed circuit (FPC) fine-pitch connectors, and memory connectors), Card connectors and thin-wall connectors, as well as CPU sockets. SV6808L is a 40% glass fiber/mineral grade with low warpage, high heat resistance, high flowability and high strength. SV6808L is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for CPU Socket connectors, Board to Board connectors, and I/O connectors.

SUMIKASUPER SV6808THF is a Liquid Crystal Polymer (LCP) product filled with glass fiber/mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SV6000 Series are used for injection molded connectors (including board-to-board (B2B) fine-pitch connectors, flexible printed circuit (FPC) fine-pitch connectors, and memory connectors), Card connectors and thin-wall connectors, as well as CPU sockets. SV6808THF is a 40% glass fiber/mineral grade with ultra-low warpage, high flowability and thin wall strength. SV6808THF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for Board to Board connectors, FPC/FFC connectors, DDR, M2, S-ATA connectors, I/O connectors, and Card connectors.

SUMIKASUPER SZ4506 is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SZ series grades are distinguished by their high heat resistance, enabling them to withstand reflow soldering. They also offer special functional properties, such as ultrahigh flow, moldability, and low warpage (Grades in the SZ Series are used in many connector applications (includinghigh-frequency, B-to-B fine-pitch, FPC fine-pitch, and memory-card). SZ4506 is a 30% mineral grade with high heat resistance, high flowability, low warpage, and high surface smoothness. SZ4506 is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micor Board to Board connectors, FPC/FFC connectors and Card connectors.

SUMIKASUPER SZ6505HF is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SZ series grades are distinguished by their high heat resistance, enabling them to withstand reflow soldering. They also offer special functional properties, such as ultrahigh flow, moldability, and low warpage (Grades in the SZ Series are used in many connector applications (includinghigh-frequency, B-to-B fine-pitch, FPC fine-pitch, and memory-card). SZ6505HF is a 25% mineral grade with low warpage, super high flowability and high surface smoothness. SZ6505HF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micor Board to Board connectors, FPC/FFC fine-pitch connectors and Card connectors.

SUMIKASUPER SZ6506HF is a Liquid Crystal Polymer (LCP) product filled with mineral. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SZ series grades are distinguished by their high heat resistance, enabling them to withstand reflow soldering. They also offer special functional properties, such as ultrahigh flow, moldability, and low warpage (Grades in the SZ Series are used in many connector applications (includinghigh-frequency, B-to-B fine-pitch, FPC fine-pitch, and memory-card). SZ6506HF is a 30% mineral grade with low warpage, super high flowability and high surface smoothness. SZ6506HF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micor Board to Board connectors, FPC/FFC fine-pitch connectors and Card connectors.

SUMIKASUPER SZ6709L is a Liquid Crystal Polymer (LCP) product filled with Glass fiber/inorganic. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding. SZ series grades are distinguished by their high heat resistance, enabling them to withstand reflow soldering. They also offer special functional properties, such as high whiteness and high relative permittivity for use as LED reflectors. SZ6709L is a 45% glass fiber/inorganic filler grade with high whiteness, high heat resistance, and high relative permittivity. SZ6709L is used for injection molding LED connectors, High-frequency connectors, and LED reflectors.

TECACOMP LCP LDS black 1014978 - Compounds Main features - developed for the LPKF-LDS® process - low thermal expansion Target Industries - automotive industry - electrical engineering - LED lighting technology - mechanical engineering

TECACOMP LCP LDS black 1049426 - Compounds Main features - developed for the LPKF-LDS® process - very low melt viscosity - very good chemical resistance - inherent flame retardant - good heat deflection temperature - low moisture absorption Target Industries - automotive industry - electrical engineering - LED lighting technology - mechanical engineering

15% glass fiber, provides easier flow than A130, Tougher

30% glass fiber, exc. bal. of properties

30% carbon fiber, conductive

LCP/PTFE, excellent wear & electrical properties at high frequencies

Glass/PTFE, best High Arc Ignition performance

15% mineral filled

30% mineral , hydrolytically stable

25% graphite, good wear characteristics

30% glass fiber, suitable for electrostatic dissipation (ESD)

25% filled, conductive grade

suitable for extrusion

30% glass fiber, extremely low CLTE and shrinkage

30% carbon fiber, exceptional strength and stiffness, conductive

30% glass fiber, higher temp. capability & easier flow than A130

Vectra C950 is an unreinforced; inherently flame retardant Vectra grade suitable for extrusion. UL-Listing V-0 in natural at 0.81mm thickness per UL 94 flame testing.

15% Glass Reinforced

30% glass fiber filled/low injection pressure

30% glass fiber, excellent flow, high temperature capability

Higher weldline strength, 35% glass filled