Description
Teflon ™ FFR 880 fluoroplastic foam resin was developed to meet the demand for superior micro-coaxial designs required for manufacturing compact electronic devices. Foamed insulation of Teflon ™ FFR 880 fluoroplastic foam resin provides high-speed data transmissions with minimal distortion and exceptional signal return loss and attenuation performance in ultra-thin wire and cable applications. In addition, the resin’s high thermal stability and melt
flow rate (nominal MFR of 42) allow for high processing speeds and excellent heat resistance. Teflon ™ FFR 880 fluoroplastic foam resin offers cable designers opportunities for miniaturization and weight savings or the use of larger conductors to construct low-loss cables, without the need for increased dielectric dimensions.

Teflon ™ FFR 880 has been compounded with a proprietary foam nucleating package and is supplied as white pellets. This resin is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the dielectric insulation.

In micro-coaxial cables using Teflon ™ FFR 880 fluoroplastic foam resin, a typical cable core would have conductor sizes of 26 AWG or smaller, wall thickness of 0.002 in or greater, with void content up to 55%. These voids are closed cell in nature and range from 0.0002 in (0.006 mm) to 0.0013 in (0.033 mm) in diameter. Achievable cell size and void content will vary based on wall thickness and processing conditions.