LNP THERMOCOMP 6F006I compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) blend containing 30% glass fiber. Added features of this grade include: Impact Modified.

THERMOCOMP Z1C00 is an injection moldable compounds with ultra-low dielectric constant under wide frequencies, with other features including dimension stability, high HDT and low water uptake. Target industries are electronics and electrical including 5G applications.