Termoplástico, no específico (TP, no específico) by Shenzhen Goldlink Tongda Electronics Co., Ltd.
Producto | Disponibilidad | Descripción del producto |
---|---|---|
GLPOLY Electrical Insulation thermal interface / PCM XK-C16 | África y Oriente Medio |
XK-C16 is produced on the basis of phase changing properties
Non-silicone with excellent dielectric and mechanical strength
Features:
Special design for easy use and storage
High viscosity (at 80°) will not drip or run like grease
Applications:
High performance computer processors
Graphic cards
|
GLPOLY Hi Frequency EMI absorber / XK-A100 | África y Oriente Medio |
During the 30MHz ~ 20GHz frequency range, electromagnetic radiation and magnetic interference can be absorb effectively. Suitable for solving electromagnetic interference radio frequency interference which generated by electronic devices or radio frequency interference.
Features:
30 MHZ~2O GHZ full frequency high absorption rate, comprehensively eliminate electromagnetic wave.
Application:
Cellular phones /Telecommunications / Camera RF module /FPC / high frequency IC chip
|
GLPOLY Low Density Thermal Gel Pad For Vehicle / XK-P10LD | África y Oriente Medio |
Low Density & Low Hardness Thermal pad series offers a high thermal conductivity and a low thermal resistance solution. This series of products are resilient and good amount of deformationn Suitable for large institutional,design tolerances, Product is Low Density The double layer use of special ultra-thin fabric reinforcement, whether punching punch, strip type, malformation designs may not be broken and variant. This product is one-sided self-adhesive silicone gel. Completely non-toxic and green products accord to international requirements.
Features:
Low density
Ultra conformable
Designed for low-stress applications
Fiberglass reinforced for puncture, shear
and tear resistance
|
GLPOLY Low Density Thermal Gel Pad For Vehicle / XK-P20LD | África y Oriente Medio |
Low Density & Low Hardness Thermal pad series offers a high thermal conductivity and a low thermal resistance solution. This series of products are resilient and good amount of deformation suitable for large institutional,design tolerances, Product is Low Density. The Double layer use of special ultra-thin fabric reinforcement, whether punching punch, strip type, Malformation designs may not be broken and variant. This product is one-sided self-adhesive silicone gel completely non-toxic and green products accord to international requirements
Features:
Low density
Ultra conformable
Designed for low-stress applications
Fiberglass reinforced for puncture, shear
and tear resistance
|
GLPOLY Non-Silicone grease / XK-XN4O | África y Oriente Medio |
Non silicone grease has been engineered to solve the problems of contamination and migration. The compound is Polysynthetic based. Thermal grease is used for rapid and efficient heat transfer.
Features:
Non-silicone
Non-curing
Resists pumping-out
Applications:
Computer CPU
LED Light
|
GLPOLY Non-Silicone Putty Gel / XK-GN30 | África y Oriente Medio |
Syringes packaging, automated production, high temperature, non-corrosive to metal, 100% thermal curing putty. Non Silicone Gel is high thermal www.glpoly.comperformance Gel , it based on TPR, Filled with a variety of high performance ceramic powder. It also has high thermal conductivity low thermal resistance, good insulation characteristics .
Features:
Good compressibility
Non-silicone
Non-curing
Resists pump-out
Applications:
Consumer electronics
Automotive Systems
Telecommunications
|
GLPOLY Non-Silicone Thermal Fiberglass / XK-FN30 | África y Oriente Medio |
XK-FN Non-silicone thermally conductive fiberglass for silicone-sensitive applications. (EX: LED , Telecom and Aerospace ). Ceramic filled and polyester resins coated either side
Features:
Polyester based
Designed for silicone-sensitive
standard applications
Applications:
Power semiconductors
Power supplies
LED
|
GLPOLY Thermal Pad / XK-P20 | África y Oriente Medio |
This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra—thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, "enviromentally friendly products".
Features:
Ultra conformable, "gel-like" modulus
Designed for low-stress applications
low hardness
Application:
Telecommunications
Computer, Between heat—generating
semiconductor and a heat sink
|
GLPOLY Thermal Pad / XK-P20S | África y Oriente Medio |
This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra—thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, "enviromentally friendly products".
Features:
Ultra conformable, "gel-like" modulus
Designed for low-stress applications
low hardness
Application:
Telecommunications
Computer, Between heat—generating
semiconductor and a heat sink
|
GLPOLY Thermally Conductive EMI Absorber / XK-J25 | África y Oriente Medio |
Both issues of thermal conductivity and Electromagnetic absorber can be solved at the same time in the limited space and time. Also simplify the mechanical design costs. Soft silicone base can reduce Internal stress and tolerance and make the terminal product design more reliable.
Features:
Effectively absorb and damp a wide range of electromagnetic waves Easily filling small gaps and uneven surfaces with soft gel
Applications:
a wide temperature range because of the inherent advantages of silicone gel
|
GLPOLY Two part thermal gel pad / XK-S20 | África y Oriente Medio |
Features:
1:1 mix
(no cure by-product)
Low stress applications
Easy to use
Fast cure by heating
Applications:
Automotive electronics
Telecommunications
Computer&peripherals
Thermally conductive &
vibration dampening
Between any
heat-generating
semiconductor and
a heat sink
|
GLPOLY Two part thermal gel pad / XK-S30 | África y Oriente Medio |
Features:
1:1 mix
(no cure by-product)
Low stress applications
Easy to use
Fast cure by heating
Applications:
Automotive electronics
Telecommunications
Computer&peripherals
Thermally conductive &
vibration dampening
Between any
heat-generating
semiconductor and
a heat sink
|
GLPOLY Two part thermal gel pad / XK-S40 | África y Oriente Medio |
Features:
1:1 mix
(no cure by-product)
Low stress applications
Easy to use
Fast cure by heating
Applications:
Automotive electronics
Telecommunications
Computer&peripherals
Thermally conductive &
vibration dampening
Between any
heat-generating
semiconductor and
a heat sink
|
GLPOLY Ultra Soft Thermal Pad / XK-P10F | África y Oriente Medio |
This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra-thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, "enviromentally friendly products".
Features:
Ultra soft (shore00=10 ) Low Oil Bleeding
Low Contact Resistance
Excellent mechanical stability
|