Modified Ethylene Copolymer CAPXIDAN® HD is a Modified Copolymer produced with a proprietary, specialized formulation. It is designed to be coextruded over Wood-Plastic Composite (WPC) deck boards to provide moisture, stain, wear resistance, aesthetics, durability at elevated temperatures, and unprecedented adhesion to the WPC substrate. CAPXIDAN® HD is a two-component capstock system. The CAPXIDAN® resin should be extruded together with a specific synergistic additive masterbatch in the recommended proportion of 98:2 by weight.

Modified Ethylene Copolymer CAPXIDAN® LG is a modified copolymer produced with a proprietary, patent pending formulation. It is designed to be coextruded over Wood-Plastic Composite (WPC) deckboards to provide moisture, stain and wear resistance, aesthetics, low gloss, durability at elevated temperatures, and unprecedented adhesion to the WPC substrate. CAPXIDAN® LG is a two-component capstock system. The CAPXIDAN® resin should be extruded together with a specific synergistic additive masterbatch in the recommended proportion of 98:2 by weight.

DOW ENDURANCE™ HFDK-0587 BK S is a crosslinkable semi-conductive compound based on an ethylene copolymer, and a select clean furnace type carbon black providing excellent smoothness compared to standard semicons. DOW ENDURANCE HFDK-0587 BK S offers outstanding extrusion properties. Low pressure and temperature generation result in outstanding scorch resistance and excellent smoothness under a wide processing window. Applications DOW ENDURANCE HFDK-0587 BK S is recommended as conductor and bonded insulation shielding for high voltage XLPE power cables. DOW ENDURANCE HFDK-0587 S is especially developed for use in high voltage cables, where it provides a clean and smooth interface with the insulation XLPE. DOW ENDURANCE HFDK-0587 BK S provides a good resistance to welding when high degassing temperatures are used. DOW ENDURANCE HFDK-0587 BK S is preferably combined with DOW ENDURANCE™ HFDK-4201 SC, or DOW ENDURANCE™ HFDK-4300 SC insulation compounds. For EHV applications, the use of DOW ENDURANCE™ HFDK-0801 EHV is recommended for use as conductor shielding. Specifications Power cables with conductor and/or insulation shielding made of DOW ENDURANCE HFDK-0587 BK S, prepared using sound, commercial fabrication practice, would be expected to meet the following cable specification(s): - IEC: 60502, 60840 and 62067 - HD: 620 S1 and 632 S1 - BS: 6622 - DIN: VDE 0273 and 0263 - Edf: HN-33-S-23 and HN-33-S-52 - US: ICEA S-108-720 Consult the regulations for complete details.

Compuesto de apantallamiento semiconductor para alta velocidad de producción HFDK-0587 BK es un compuesto semiconductor reticulable basado en un copolímero de etileno, que ofrece propiedades excepcionales de extrusión. La generación a baja temperatura y presión le aporta una resistencia excepcional a la quemadura y una suavidad excelente en diversas condiciones de procesamiento. Aplicaciones: HFDK-0587 BK está recomendado como apantallamiento aislante conductor y pegado para cables de XLPE de media tensión. Está desarrollado especialmente para una fabricación a alta velocidad junto con compuestos aislantes de HFDK-4202 y HFDK-4201. Especificaciones: Los cables con apantallamiento conductor y aislante de HFDK-0587 BK preparados conforme a prácticas de fabricación comerciales estándar en el sector, deben cumplir las especificaciones siguientes: - IEC: 60502 y 60840 - HD: 620 S1 y 632 S1 - BS: 6622 - DIN: VDE 0273 y 0263 - Edf: HN-33-S-23 y HN-33-S-52 Consulte la información completa en las normativas

SEC 39001 Specialty Ethylene Copolymer is an ethylene butene copolymer, offers excellent processing and performance in various applications such as footwear and wire & cable. Main Characteristics: - Pellet form - Excellent processability Applications: - Foam application - Halogen free flame retardance (HFFR) compound

FUSABOND™ N493 is an anhydride modified ethylene copolymer. Uses - Polymer Modifier Composition - Medium% By Weight Maleic Anhydride - Graft levels are defined as: - Low < 0.2%; Medium 0.2-0.5%; High 0.5-1.0%; Ultra high > 1.0% Applications - Impact modifier for polyamide blends. - Blends for golf balls covers. - Compatibilizer for flame retardant fillers in non-halogen flame retardant polyolefin-based wire and cable compounds. - Compatibilizer or adhesion promoter between polyolefins and metals, polyamide, cellulose, and glass fibers.

FUSABOND™ N525 is an anhydride modified ethylene copolymer. Uses - Polymer Modifier Composition - High% By Weight Maleic Anhydride - Graft levels are defined as: - Low < 0.2%; Medium 0.2-0.5%; High 0.5-1.0%; Ultra high > 1.0% Applications - Impact modifier for polyamide blends with high grafting level of maleic anhydride. - Efficient modifier for polyolefin based wire and cable compounds. - Blends for golf balls covers. - Compatibilizer or adhesion promoter between polyolefins and metals, polyamide, cellulose, and glass fibers.

FUSABOND™ N598 is an anhydride modified ethylene copolymer. Uses - Polymer Modifier Composition - Medium% By Weight Maleic Anhydride - Graft levels are defined as: - Low < 0.2%; Medium 0.2-0.5%; High 0.5-1.0%; Ultra high > 1.0% Features - Good balance of toughness and mold flow in PA6 modification. Applications - Impact modifier for polyamide blends with medium grafting level of maleic anhydride. - Provides impact resistance for high flow polyamide compounds. - Compatibilizer or adhesion promoter between polyolefins and metals, polyamide, cellulose, and glass fibers.