LNP STAT-LOY 63000CT compound is based on Polycarbonate / Polyester alloy containing proprietary additives targeted for advanced semiconductor packaging applications. Added features of this grade include: LNP Clean Compounding Technology, Permanently Anti-Static, Translucent.

LNP STAT-LOY 63000CTC compound is based on Polycarbonate / Polyester alloy containing proprietary additives targeted for advanced semiconductor packaging applications. Added features of this grade include: LNP Clean Compounding Technology, Permanently Anti-Static, Translucent.

LNP STAT-LOY 63000CTU compound is based on Polycarbonate / Polyester alloy containing proprietary additives targeted for advanced semiconductor packaging applications. Added features of this grade include: LNP Clean Compounding Technology, Permanently Anti-Static, , UV Stabilized, Translucent.

LNP STAT-LOY D3000IEU6 compound is based on Polycarbonate (PC) Copolymer that has been designed towards ATEX compliant applications requiring antistatic. The material has an optimized balance between surface resistivity and impact strength retention after hydro aging, and has excellent low temperature impact. The material is available in a wide range of dark and light colors, including UV stabilization.

LNP STAT-LOY N30009 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Flame Retardant.

LNP STAT-LOY N30009 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Flame Retardant.

LNP STAT-LOY N30009 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Flame Retardant.

LNP STAT-LOY NX03583 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Flame Retardant.

LNP STAT-LOY NX13401 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Flame Retardant, Excellent Mold Release.

LNP THERMOCOMP 6C004XXAR1 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Improved Chemical Resistance, Lower Warp and Good Surface Finish.

LNP THERMOCOMP DC0041XA51 compound is based on PC Copolymer Resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Smooth Surface Finish. This halogen-free flame retardant resin is EN45545 R1 HL3 and R7 HL2 compliant and an ideal candidate for train interior applications (category R1). It also meets requirements of NFPA-130a

LNP THERMOCOMP AM DC004XXA11is a compound based on High Heat PC resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications, including mid-temperature autoclaving tooling. This compound can offer higher temperature performance than standard PC and avoid some of the processing challenges associated with high temperature materials.

LNP THERMOCOMP DC004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish.

LNP THERMOCOMP DF004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish.

LNP THERMOCOMP 6F006 compound is a 30% glass fiber filled PBT/PC copolymer based compound, which has been optimized for LASER welding technology. Added features of this material include: infrared transparency, high modulus, improved warpage control, and optionally, a black color targeted for LASER transparency or for LASER absorption.

LNP THERMOCOMP 9F005P compound is based on Polycarbonate (PC) resin containing 25% glass fiber. Added features of this grade include: Exceptional Processing, CLTE close to Aluminum.

LNP THERMOCOMP 9X02540 compound is based on Polycarbonate / Polyester blend containing 20% glass fiber. Added features of this grade include: Flame Retardant, Improved Impact.

LNP THERMOCOMP 9X02841 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) blend containing 15% glass fiber.

LNP THERMOCOMP 9X07430 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) blend containing glass fiber and talc. Added features of this grade include: Opaque, Weatherable.

LNP THERMOCOMP 9X22141 compound (also known as ER016141) is based on Polycarbonate (PC) and Acrylonitrile butadiene styrene (ABS) resins containing 20% glass fiber. Added features of this grade include: High Stiffness, Excellent Processing, Good Dimensional Stability, Good Impact Performance, UL94 HB Rating

LNP THERMOCOMP D10001VI is based on Polycarbonate (PC) resin. It is colorable, non Chlorinated and non Brominated, UL94 V0@0.8mm LDS compound for antenna or electric circuit manufacturing. Added features of this material include good process-ability, high impact strength, robust flame retardant for thin-wall design, good color-ability.

LNP THERMOCOMP D10001VP compound is based on Polycarbonate (PC) resin. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Non-Brominated, Non-Chlorinated Flame Retardant, High Impact Strength and Ductility under room and low temperatures and Good Outdoor Weathering performance. D10001VP is available in black only.

LNP THERMOCOMP D151 compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: High Modulus, Good Surface, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP D151RC compound is based on recycled Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: High Modulus, Good Surface, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 35%.

LNP THERMOCOMP D151RCC compound is based on recycled Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: High Modulus, Good Surface, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 50%.

LNP THERMOCOMP D251 compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP D251RC compound is based on recycled Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 35%.

LNP THERMOCOMP D251RCC compound is based on recycled Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Colorable, High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 40%

LNP THERMOCOMP D251U compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant, Good UV Stability.

LNP THERMOCOMP D351 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP D351RC compound is based on recycled Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 35%.

LNP THERMOCOMP D351RCC compound is based on recycled Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 40%.

LNP THERMOCOMP D451 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP D451RC compound is based on recycled Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 35%.

LNP™ THERMOCOMP™ COMPOUND D451RCC is a compound based on Recycle Polycarbonate resin containing Glass Fiber, Flame Retardant. Added features of this material include high modulus, good flatness, good impact performance, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) polycarbonate content up to 35%.

LNP THERMOCOMP D452 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant, High Flow, IMR/IMD Capability.

LNP THERMOCOMP D551 compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP D551RC compound is based on recycled Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 30%.

LNP THERMOCOMP COMPOUND D551RCC is a compound based on Recycle Polycarbonate resin containing Glass Fiber, Flame Retardant. Added features of this material include high modulus, good flatness, good impact performance, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) polycarbonate content up to 25%.

LNP THERMOCOMP DB008ERP compound is based on Polycarbonate (PC) resin containing 40% glass bead. Added features of this grade include: Easy Molding, Mold Release.