DESCRIPTION Cosmic E484 is a mineral filled, glass reinforced, electrical grade epoxy molding compound which is supplied in a granular form. FEATURES It has excellent mechanical strength and electrical properties, especially at high temperatures. It has passed NASA out-gassing tests. APPLICATIONS Used in electrical hardware applications such as underwater connectors and other insulation applications.

DESCRIPTION Cosmic E484-FDA is a mineral filled, glass reinforced, electrical grade epoxy molding compound which is supplied in a granular form. E484-FDA has been approved for direct food contact use. FEATURES It has excellent mechanical strength and electrical properties, especially at high temperatures. It has passed NASA out gassing tests. APPLICATIONS Used in electrical hardware applications such as underwater connectors and other insulation applications.

DESCRIPTION Cosmic E4920 is a mineral filled epoxy molding compound which is available either in a granular form, or preformed in a variety of sizes and weights. FEATURES It has excellent moisture resistance, thermal cycling stability and outstanding moldability. Parts molded from this material do not support fungus growth. It is available in a wide flow range to suit custom molding requirements. E4920 can be supplied in black, gold, green or red. It has a shelf life of six months when stored at 5°C. APPLICATIONS It is designed for encapsulation of passive devices such as capacitors, inductors, diodes and rectifiers.

DESCRIPTION Cosmic E4920D is a mineral filled epoxy molding compound which is available either in a granular form, or preformed in a variety of sizes and weights. FEATURES It has excellent moisture resistance, thermal cycling stability and outstanding moldability. Parts molded from this material do not support fungus growth. It is available in a wide flow range to suit custom molding requirements. E4920D can be supplied in black, gold, green or red. It has a shelf life of eight months when stored at 5°C. APPLICATIONS It is designed for encapsulation of passive devices such as capacitors, inductors, diodes and rectifiers.

DESCRIPTION Cosmic E4920FC is a mineral filled epoxy molding compound which is available either in a granular form, or preformed in a variety of sizes and weights. FEATURES It has excellent moisture resistance, thermal cycling stability and outstanding moldability. Parts molded from this material do not support fungus growth. It is available in a wide flow range to suit custom molding requirements. E4920FC can be supplied in black, gold, green or red . It has a shelf life of eight months when stored at 5°C. APPLICATIONS It is designed for encapsulation of passive devices such as capacitors, inductors, diodes and rectifiers.

DESCRIPTION Cosmic E4930R is a mineral filled, application specific epoxy molding compound which is supplied in a granular form. FEATURES It has excellent moisture resistance and thermal cycling stability. Standard spiral flow range is 30-40" (EMMI) at 160°C and 1000 psi, and a flow duration of 40-50 seconds at 325 - 1000 psi. It has a hot plate gel time of 35-45 seconds at 160°C. APPLICATIONS Used to encapsulate optocouplers, capacitors, resistors, resistor networks, transistors, SOIS's and QFP.

DESCRIPTION Cosmic E4940P is a mineral filled, glass reinforced epoxy molding compound which is supplied in a granular form. FEATURES It has excellent dimensional stability, improved thermal cycling and exceptional moisture resistance. Standard spiral flow range is 25-35" (EMMI) at 150°C and 1000 psi. It has a hot plate gel time of 22-30 seconds at 160°C, and 18-26 seconds at 182°C. It has a shelf life of eight months when stored at 5°C. APPLICATIONS It is designed for use in high-volume encapsulation of resistor networks and fiber-optic connectors requiring high quality, reliability and good moldability.

DESCRIPTION Cosmic E4940S is a mineral filled epoxy molding compound which is supplied in a granular form. FEATURES It has excellent dimensional stability, improved thermal cycling and exceptional moisture resistance. Standard spiral flow range is 25-35" (EMMI) at 150°C and 1000 psi. It has a hot plate gel time of 22-30 seconds at 160°C, and 18-26 seconds at 182°C. It has a shelf life of eight months when stored at 5°C. APPLICATIONS It is designed for use in high-volume encapsulation of resistor networks and fiber-optic connectors requiring high quality, reliability and good moldability.

Cosmic FARBOSET 1115 Black is a mineral filled epoxy molding compound featuring fast cure rates, and excellent hot strength. APPLICATIONS It is designed for the encapsulation of coils, transformers, bushings, switches and other electrical and electronic components requiring good hot rigidity in molding. This material is used extensively in injection and transfer molding.

Cosmic FARBOSET 1160 Black is a mineral filled epoxy molding compound featuring fast cure rates, long flow and excellent thermal shock resistance. APPLICATIONS It is designed for the encapsulation of coils, transformers, capacitors, diodes, relays, and other electrical and electronic components requiring good hot rigidity in molding.

Cosmic FARBOSET 1190 Black is a fast curing, mineral & glass filled, epoxy molding compound with improved strength properties. APPLICATIONS It is designed for the encapsulation of coils, transformers, switches and other electrical and electronic components requiring excellent thermal shock resistance. This material exhibits superior resistance to cracking.

Cosmic FARBOSET 2460 is a mineral-filled epoxy molding compound featuring fast cure rates, excellent moldability and superior thermal shock and moisture resistance. APPLICATIONS This compound was especially formulated for improved resistance to moisture ingress along with a high glass transition temperature for optimum reliability performance. It is designed to encapsulate a wide range of devices including tantalum and ceramic capacitors, resistors, resistor networks and high performance coils.

Cosmic FARBOSET 2461 Black is a mineral-filled epoxy molding compound featuring fast cure rates, superb moldability, excellent thermal shock and moisture resistance. APPLICATIONS This compound was especially formulated to achieve a high glass transition temperature for optimum reliability performance in very thin sections. It is designed to encapsulate a wide range of devices including capacitors, resistors, and inductor coils.

Cosmic FARBOSET 2472V0 is a mineral-filled novolac epoxy molding compound featuring fast cure rates, excellent moldability and superior thermal shock and moisture resistance. It is specially formulated for improved resistance to moisture ingress, along with a high glass transition temperature for optimum reliability performance APPLICATIONS It is designed to encapsulate a wide range of devices including capacitors, resistors, resistor networks, relays, and high performance coils. Its low viscosity (long spiral flow) allows the molding of delicate components in large, multi-cavity molds.

Cosmic FARBOSET 5000 Black is a mineral and glass filled epoxy molding compound featuring fast cure rates, low abrasion and excellent hot strength. APPLICATIONS It is designed for the encapsulation of coils, transformers, switches and other electrical components requiring good hot rigidity in molding. It's low abrasion characteristics makes 5000 especially suited for the encapsulation of solenoid valves.

Cosmic FARBOSET 9025 is a nonanhydride epoxy powder coating designed as an encapsulant for electronic components, and features excellent resistance to cracking during thermal cycling. APPLICATIONS This compound is designed for coating resistor networks, hybrid circuits, varistors and ceramic capacitors. It is suitable for use on wheel and fluid bed equipment.

Cosmic FARBOSET 9146 is a nonanhydride, dielectric grade epoxy powder coating featuring superior electrical and moisture resistance. APPLICATIONS This compound is designed for encapsulation of hybrids, mica capacitors and other semi conductor grade devices requiring very high purity and optimum moisture performance. It is an ideal candidate for chip on board applications due to its excellent adhesion characteristics.