Thermal Gap Pad is design to be used in the applications that require the minimum amount of pressure on components and high thermal conductivity. Suqun Thermal gap pad is very conformable, filled silicone rubber material and it is easy to fill in air gaps between PC board and heat sinks or a metal chassis.

Our unique silicone chemistry ensures high compliance to surface irregularity and good surface wetting property, thus offering very low Thermal Contact Resistance at Thermal Joint, and very efficient heat transfer between hot spots and heat sink.

Our Thermal Gap Pad is highly tacky to most surfaces, so no PSA is required. Optionally, we offer one side non tacky to facilitate application that requires the easy removal of hot side component.

Product Features

• Electrically Insulated

• Optional Single or 2 Sides Tacky

• RoHS Compliant

• Customized color and size

• Optional Glass fiber reinforcement

• Available in ultra soft pad to achieve over 50% deflection under low stress.

Typical Applications

• Heat Sink / Chassis

• Memory Modules

• Server and Network Equipment

• Large Storage Device

• Automotive Electronics

• Communication Equipment

• LED Lighting

• Power Supplies

• LCD Display

• Gaming / CAD Video Processor