AvaSpire® AV-630 is an unreinforced polyaryletherketone (PAEK) developed as an alternative to low melt flow PEEK for the extrusion of ultra-thin films. Films with thicknesses as low as 0.2 mils (5 microns) can be successfully melt extruded out of AV-630 using conventional thermoplastics film extrusion equipment.

Films of AV-630 offer certain performance advantages over comparable PEEK film. These include improved toughness and ductility, a higher retention of mechanical integrity at temperatures above 150°C, better acceptance of adhesives and improved flame propagation resistance properties. Ultra-thin films (<15 microns thick) also exhibit a more flexible, less crinkly feel than that of PEEK films at comparable thicknesses.

Sub-mil thick films produced from AV-630 can be utilized in a wide range of industrial applications. Typical applications include capacitors, electrical insulation, flexible circuitry substrates, composite film layers, specialty laminates, moisture barriers, liners and aerospace films, such a thermal acoustical insulation blanket bagging materials.

• Natural: AvaSpire® AV-630 NT