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Hostaform® C 9021 SW

Generic Family: Acetal (POM) Copolymer • Supplied by: Celanese Corporation
Injection molding type like C 9021; special modified with anti-friction additives for prevention of squeaking noise
Chemical abbreviation according to ISO 1043-1: POM-KD10 Molding compound ISO 29988-POM-K,KD10,GNRS2,3-2 POM copolymer Injection molding type, special modified with anti-friction additives for prevention of squeaking noise; good chemical resistance to solvents, fuel and strong alkalis as well as good hydrolysis resistance; high resistance to thermal and oxidative degradation. UL-registration in natural and black and a thickness more than 1.5 mm as UL 94 HB. Burning rate ISO 3795 and FMVSS 302 < 100 mm/min for a thickness more than 1,5 mm. Ranges of applications: For sliding combinations with low wear and low coefficient of friction, prevents squeaking noise. UL = Underwriters Laboratories (USA) FMVSS = Federal Motor Vehicle Safety Standard (USA)
General Properties

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Material Status
Commercial: Active
Documents
UL Yellow Cards

E42337 - Celanese Services Germany GmbH

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Automotive Applications
Automative Specification
BOSCH N28 BN22-O015 Color: Natural & Black
Processing Method
Extrusion
Multi-Point Data
  • Creep Modulus vs. Time (ISO 11403)
  • Isochronous Stress vs. Strain (ISO 11403)
  • Isothermal Stress vs. Strain (ISO 11403)
  • Secant Modulus vs. Strain (ISO 11403)
  • Shear Modulus vs. Temperature, Dynamic (ISO 11403)
Other Properties
Additive, Features, Forms, Density, Melt Volume-Flow Rate (MVR), Molding Shrinkage, Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Stress at Yield, Tensile Strain at Yield, Nominal Tensile Strain at Break, Tensile Creep Modulus 1h, Tensile Creep Modulus 1000h, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Ball Indentation Hardness, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Melting Temperature, Coefficient of Linear Thermal Expansion, Flow, Surface Resistivity, Volume Resistivity, Relative Permittivity, Dissipation Factor, Comparative Tracking Index (CTI), Flame Rating, Additional Properties, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Rate, Back Pressure
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Processing

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