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Hostaform® C 2521 G

Generic Family: Acetal (POM) Copolymer • Supplied by: Celanese Corporation
Stiff-flowing grade for injection molding and extrusion; modified with (R) GUR (PE-UHMW)
Chemical abbreviation according to ISO 1043-1: POM Molding compound ISO 29988- POM-K, M-GNS, 01-001 POM copolymer Stiff-flowing type for injection molding and extrusion, modified with (R) GUR (PE-UHMW); good chemical resistance to solvents, fuel and strong alkalis as well as good hydrolysis resistance; high resistance to thermal and oxidative degradation; with GUR (PE-UHMW) modified extrusion type, therefore very good lubricating properties. Burning rate ISO 3795 and FMVSS 302 < 100 mm/min for a thickness more than 1 mm. Ranges of applications: For injection molding parts and semi-finished products with higher requirements on lubricating properties. FMVSS = Federal Motor Vehicle Safety Standard (USA)
General Properties

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Material Status
Commercial: Active
Documents
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Technical Datasheet

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Automotive Applications
Processing Method
Blow Molding
Multi-Point Data
  • Isothermal Stress vs. Strain (ISO 11403)
  • Secant Modulus vs. Strain (ISO 11403)
Other Properties
Additive, Features, Forms, Density, Melt Volume-Flow Rate (MVR), Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Stress at Yield, Tensile Strain at Yield, Nominal Tensile Strain at Break, Tensile Creep Modulus 1h, Tensile Creep Modulus 1000h, Flexural Modulus, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Ball Indentation Hardness, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Melting Temperature, Coefficient of Linear Thermal Expansion, Flow, Surface Resistivity, Volume Resistivity, Electric Strength, Relative Permittivity, Dissipation Factor, Comparative Tracking Index (CTI), Additional Properties, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Rate, Back Pressure
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Processing

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Where To Buy

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