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LEXAN™ Copolymer ML6411 - Asia

Generic Family: Polycarbonate • Supplied by: SABIC
LEXAN ML6411 polycarbonate (PC) siloxane resin, is a high flow opaque injection molding (IM) grade with very low temperature ductility characteristics. This grade offers UL94 V0 @ 1.5mm and 5VA @ 3.0mm flame retardancy based on non-chlorine, non-bromine FR systems. LEXAN ML6411 resin offers excellent processing characteristics with opportunity for shorter IM cycle times compared to standard PC. This product is available in a wide range of opaque colors and is an excellent candidate for a wide range of electrical applications.
General Properties

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Material Status
Commercial: Active
Documents
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E207780 - SABIC JAPAN L L C

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description

SABIC solution for EV supply equipment

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Availability
Asia Pacific
Uses
Appliances
Processing Method
Injection Molding
Other Properties
Features, Also Available In, Density / Specific Gravity, Density, Melt Mass-Flow Rate (MFR), Melt Volume-Flow Rate (MVR), Molding Shrinkage, Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Modulus, Tensile Strength at Yield, Tensile Stress at Yield, Tensile Strength at Break, Tensile Stress at Break, Tensile Elongation at Yield, Tensile Strain at Yield, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Stress, Flexural Strength at Yield, Notched Izod Impact, Notched Izod Impact Strength, Instrumented Dart Impact, DTUL (66 psi) - Unannealed, DTUL (0.45 MPa) Unannealed, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Vicat Softening Temperature, Ball Pressure Test, CLTE, Flow (TMA), Coefficient of Linear Thermal Expansion, Flow, CLTE, Transverse (TMA), Coefficient of Linear Thermal Expansion, Transverse, RTI Elec, RTI Imp, RTI Str, Volume Resistivity, Dielectric Strength, Comparative Tracking Index (CTI), Comparative Tracking Index, High Amp Arc Ignition (HAI), Hot-wire Ignition (HWI), Flame Rating, Glow Wire Flammability Index, Glow Wire Ignition Temperature, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Notes
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Processing

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