SUMIKASUPER® E6810KHF
E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C.
E6810KHF is a 50% glass fiber/mineral grade with low warpage, low shrinkage and low anisotropy. E6810KHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for board-to-board (B2B) and Wire-to-board (W2B) connectors, DDR, M2, S-ATA connectors, FPC connectors, and I/O connectors.
General Properties
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