SUMIKASUPER® E6808GHF
E6000HF series are distinguished by their high-flow, low-warpage, and high strength. They also provide high heat resistance to withstand reflow soldering. E6000HF Series grades are typically processed at 350°C.
E6808GHF is a 40% glass fiber/mineral grade with low warpage, high flowability, and high thin-wall strength. E6808GHF is used for injection molding various connectors, relay parts, coil seals, bobbins. It is the recommended grade for micro Board to Board connectors, FPC/FFC fine-pitch connectors, DDR , M2, S-ATA connectors, I/O connectors, and Card connectors.
General Properties
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