LiPOLY® T-top81
LiPOLY T-top81 is a high deflection gap pad,with outstanding thermal conductivity and low thermal resistance in formshape. T-top81 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. T-top81 was designed for thermal modules with limited gap sizes and low compression force.
Features-
- Thermal conductivity: 8.0 W/m*K
- High compression rate
- Low thermal impedance
- Silicone compound
- UL 94V-0 qualified
Typical Applications-
- Between CPU and heat sink.
- Between a component and heat sink
- Flat-panel displays
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
General Properties
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Processing
Find specific processing information for LiPOLY® as well as general information for the Silicone generic family. Register or Sign In for more information.
Where To Buy
You can purchase LiPOLY® T-top81 from 1 distributors or manufacturers. Register or Sign In for more information.
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