Two-component encapsulating system based on polyurethane with high thermal conductivity. The resin component is formulated with a mineral filler which provides self-extinguishing properties without use of halogen compounds. The resin does not contain halogenated flame-retardants, heavy metals or chlorofluorocarbons. The material exhibits properties according to UL 94 V-0 at a thickness of 6 mm.

The cured polymer exhibits tough-elastic properties as well as outstanding adhesion to most plastic materials, metals and glass and excellent behavior in thermal cycle tests.

Temperature range of use: -40°C to +135°C.

The casting resin is used with WEVONAT 900

Applications: Encapsulation of applications that require high thermal resistance and endurance, like coils, sensors or PCBs