WEVOPUR 500M/WEVONAT 300
The resin component is formulated with a non-abrasive mineral filler.
The system exhibits tough-elastic properties.
The resin is silicon-free.
Temperature range of use: -40°C to +120°C.
The casting resin is used with WEVONAT 300
Applications: Encapsulation of electrical components for low and medium voltage applications.
General Properties
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Technical Datasheet (English)
Download DocumentProcessing
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Where To Buy
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