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Hostaform® C 52021 LS

Generic Family: Acetal (POM) Copolymer • Supplied by: Celanese Corporation
Injection molding grade with extremely high flow
POM copolymer Extremely easy flowing Injection molding type for very thin-walled precision molded parts with unfavourite flow-path-wall thickness relation; permits processing at reduced temperature and also shorter cycle times; for mechanical lower requirements; good chemical resistance to solvents, fuel and strong alkalis as well as good hydrolysis resistance; high esistance to thermal and oxidative degradation. With UV Additives Ranges of applications: For very thin-walled precision molded parts with unfavourite flow-path-wall thickness relation; permits processing at reduced temperature and also shorter cycle times.
General Properties

Access the complete datasheet details for Hostaform® C 52021 LS when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Commercial: Active
Documents
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Technical Datasheet

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Processing Method
Injection Molding
Multi-Point Data
  • Isothermal Stress vs. Strain (ISO 11403)
  • Secant Modulus vs. Strain (ISO 11403)
  • Shear Modulus vs. Temperature, Dynamic (ISO 11403)
  • Shear Stress vs. Shear Rate (ISO 11403)
  • Viscosity vs. Shear Rate (ISO 11403)
Other Properties
Additive, Features, Forms, Density, Melt Volume-Flow Rate (MVR), Molding Shrinkage, Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Stress at Yield, Tensile Strain at Yield, Nominal Tensile Strain at Break, Tensile Creep Modulus 1h, Tensile Creep Modulus 1000h, Flexural Modulus, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Ball Indentation Hardness, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Melting Temperature, Coefficient of Linear Thermal Expansion, Flow, Surface Resistivity, Volume Resistivity, Electric Strength, Relative Permittivity, Dissipation Factor, Comparative Tracking Index (CTI), Melt Density, Melt Specific Heat, Melt Thermal Conductivity, Ejection Temperature, Additional Properties, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Rate, Back Pressure
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Processing

Find specific processing information for Hostaform® POM as well as general information for the Acetal (POM) Copolymer generic family. Register or Sign In for more information.

Where To Buy

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