Epoxies, Ect. 20-3035 (Cat.30)
20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required.
This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance.
Features:
- Low Dielectric Constant
- Low Coefficient of Thermal Expansion
- Low Shrinkage
- Low Density
- Excellent Moisture Resistance
General Properties
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Technical Datasheet (English)
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Where To Buy
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