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KYOCERA KE-850SP

Generic Family: Epoxy; Epoxide • Supplied by: KYOCERA Chemical Corporation
Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound.

Strong Points
  • High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress.
  • Used in Auto Molding System by Rapid Cure Grades.
  • KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K).

Application
  • Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics.
  • Packages for High Heating Volume such as Power Module.
General Properties

Access the complete datasheet details for KYOCERA KE-850SP when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Asia Pacific
Uses
Electrical/Electronic Applications
Other Properties
Features, Density / Specific Gravity, Spiral Flow, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Gel Time
Access 7 properties in Plastics. Create your free account or sign into Prospector.
Processing

Find specific processing information for KYOCERA as well as general information for the Epoxy; Epoxide generic family. Register or Sign In for more information.

Where To Buy

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