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Torlon® 5030

Generic Family: Polyamide-imide • Supplied by: Syensqo
Torlon® 5030 is a 30% glass-fiber reinforced grade of polyamide-imide (PAI) resin. It offers high strength and modulus and exceptional creep resistance. It has thermal expansion characteristics similar to aluminum and therefore excellent dimensional stability.

Torlon® PAI has the highest strength and stiffness of any thermoplastic up to 275°C (525°F). It has outstanding resistance to wear, creep and chemicals.

The mechanical properties of Torlon® 5030 resin make it a candidate for metal replacement in high temperature, high stress applications. In addition, it offers outstanding electrical properties, which makes it ideal for high performance parts such as connectors, switches and relays.
  • High Flow: Torlon® 5030-HF
  • Low Flow: Torlon® 5030-LF
  • Extrusion Grade: Torlon® 5030-E
General Properties

Access the complete datasheet details for Torlon® 5030 when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Commercial: Active
Documents
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E140728 - Solvay Specialty Polymers USA L L C

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Processing - Design Guide (English)

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Processing - Injection (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Aerospace Applications
Processing Method
Injection Molding
Multi-Point Data
  • Isothermal Stress vs. Strain (ISO 11403)
  • Viscosity vs. Shear Rate (ISO 11403)
Other Properties
Filler / Reinforcement, Features, RoHS Compliance, Forms, Density / Specific Gravity, Mold Shrink, Linear-Flow, Water Absorption @ 24 hrs, Tensile Modulus, Tensile Strength, Tensile Stress, Tensile Elongation at Break, Flexural Modulus, Flexural Strength, Compressive Modulus, Compressive Strength, Notched Izod Impact, Unnotched Izod Impact, DTUL (264 psi) - Unannealed, Thermal Conductivity, Surface Resistivity, Volume Resistivity, Dielectric Strength, Dielectric Constant, Dissipation Factor, Additional Properties, Drying Temperature, Drying Time, Suggested Max Moisture, Rear Temperature, Nozzle Temperature, Mold Temperature, Back Pressure, Screw Speed, Screw L/D Ratio
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Processing

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Where To Buy

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