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Hostaform® C 2521 XAP®2

Generic Family: Acetal (POM) Copolymer • Supplied by: Celanese Corporation
low Emission
POM copolymer Stiff-flowing type for injection molding and extrusion with high impact toughness and good tracking resistance over a high range of temperature; good chemical resistance to solvents, fuel and strong alkalis as well as good hydrolysis resistance; high resistance to thermal and oxidative degradation. With reduced emissions especially for automotive interior application. Burning rate according to FMVSS 302 < 100 mm/min (1 mm thickness) Emission according to VDA 275 < 5 mg/kg (natural grades) Emission according to VDA 275 < 5 mg/kg (colored grades).
General Properties

Access the complete datasheet details for Hostaform® C 2521 XAP®2 when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Commercial: Active
Documents
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Technical Datasheet

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Automotive Applications
Automative Specification
DAIMLER DBL 5404
Processing Method
Blow Molding
Multi-Point Data
  • Creep Modulus vs. Time (ISO 11403)
  • Isochronous Stress vs. Strain (ISO 11403)
  • Isothermal Stress vs. Strain (ISO 11403)
  • Secant Modulus vs. Strain (ISO 11403)
  • Shear Modulus vs. Temperature, Dynamic (ISO 11403)
  • Shear Stress vs. Shear Rate (ISO 11403)
  • Viscosity vs. Shear Rate (ISO 11403)
Other Properties
Additive, Features, Forms, Density, Melt Volume-Flow Rate (MVR), Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Stress at Yield, Tensile Strain at Yield, Nominal Tensile Strain at Break, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Melting Temperature, Coefficient of Linear Thermal Expansion, Flow, Coefficient of Linear Thermal Expansion, Transverse, Surface Resistivity, Volume Resistivity, Electric Strength, Relative Permittivity, Dissipation Factor, Comparative Tracking Index (CTI), Melt Density, Melt Specific Heat, Melt Thermal Conductivity, Ejection Temperature, Additional Properties, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Rate, Back Pressure
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Processing

Find specific processing information for Hostaform® POM as well as general information for the Acetal (POM) Copolymer generic family. Register or Sign In for more information.

Where To Buy

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