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KetaSpire® KT-851

Generic Family: Polyetheretherketone • Supplied by: Syensqo
KetaSpire® KT-851 resin is a depth-filtered grade of polyetheretherketone (PEEK) specially designed for use in extruded wire insulation coating. KT-851 offers the needed balance of properties and processability for applying thin insulation coatings onto copper or other conducting wire using a continuous extrusion process to achieve a robust insulation coating that is capable of withstanding the harsh use environments of many industrial applications.

KetaSpire® PEEK is produced to the highest industry standards and is characterized by a distinct combination of properties, which include excellent chemical resistance to organics, acids and bases, best in class fatigue resistance, excellent wear resistance, ease of melt processing and high purity.

The pellets are supplied with a very light dusting (0.01%) of calcium stearate to aid with conveying through single screw extruder-based processing equipment.

Natural: KetaSpire® KT-851 NT
General Properties

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Material Status
Commercial: Active
Documents
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E140728 - Solvay Specialty Polymers USA L L C

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Electrical/Electronic Applications
Processing Method
Injection Molding
Other Properties
Additive, Features, Agency Ratings, RoHS Compliance, Appearance, Forms, Density / Specific Gravity, Melt Mass-Flow Rate (MFR), Mold Shrink, Linear-Flow, Mold Shrink, Linear-Trans, Water Absorption @ 24 hrs, Tensile Modulus, Tensile Modulus, Tensile Strength, Tensile Stress at Yield, Tensile Elongation at Yield, Tensile Strain at Yield, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Strength, Flexural Stress, Compressive Strength, Shear Strength, Notched Izod Impact, Notched Izod Impact Strength, Unnotched Izod Impact, Unnotched Izod Impact Strength, Rockwell Hardness, Durometer Hardness, DTUL (264 psi) - Annealed, Glass Transition Temperature, Peak Melting Temperature, CLTE, Flow (TMA), Specific Heat, Thermal Conductivity, Surface Resistivity, Volume Resistivity, Dielectric Strength, Melt Viscosity, Additional Information, Drying Temperature, Drying Time, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Mold Temperature, Injection Rate, Screw Compression Ratio, Injection Notes
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Processing

Find specific processing information for KetaSpire® PEEK as well as general information for the Polyetheretherketone generic family. Register or Sign In for more information.

Where To Buy

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