Chemraz ® XRZ, a perfluoroelastomer, is specifically developed to exceed the most rigorous demands of aggressive in situ NF3 plasma cleaning.

Chemraz ® XRZ withstands the application challenges typically found in HDPCVD (high-density plasma chemical vapor deposition), PECVD (plasma enhanced CVD), and newer PEALD (plasma-enhanced atomic layer deposition) process chambers.

Because of its unique molecular composite structure, Chemraz ® XRZ provides the highest plasma resistance available to fluorine plasma processes, resulting in minimal contamination. This leads to increased seal integrity and longer seal lifetimes, reducing downtime and driving higher wafer processing yields.

Chemraz ® XRZ can be used for both static and semi- dynamic dry wafer processing applications such as etch, deposition (CVD, HDPCVD, PEALD), and remote plasma cleans. Chemraz ® XRZ remains stable at operating temperatures up to 572°F (300°C) while maintaining exceptional compression set.