Features and Benefits - Meets ASTM D4894 Type IV, Grade 2 resin - Semi-free-flowing compression molding powder - High bulk density - Good for large billets and thin walled isostatic moldings - Very dense polymer structure, similar to non-free-flowing grades - Excellent flex life - Good dielectric strength

Features and Benefits - Meets ASTl\/l D 4894 Type lV, Grade 2 resin - Molding and ram extrusion powder with very good free-flow properties - Good metering properties - Good mold filling behavior - Good electrical and mechanical properties - Very good surface quality of isostatic moldings - Excellent for small parts

Features and Benefits - Meets ASTM D 4894 Type IV, Grade 2 resin - Molding and ram extrusion powder with very good free-flow properties - Good metering properties - Good mold filling behavior - ldeal for large billets - Good electrical and mechanical properties - Used in automatic, isostatic and general compression molding - Excellent for finished molded parts

Features and Benefits - Meets ASTM D 4894 Type II - Non-free-flowing powder grade - Very fine particle size - Good electrical and mechanical properties - Low molding pressure - Used in large billet molding - Excellent for production of very thin skived film

Dyneon™ TF 2025 Z PTFE is an ideal grade for pipe liner applications in chemical plant construction due to high green strength. Product Features: - High molecular weight - Fine powder grade for low to medium reduction ratio - High stretch ratio - Processable by standard paste extrusion methods - Can be used for unsintered thread sealing tape, joint sealing and pipe lining, yarns and thick wall tubing - Meets ASTM D4895-04 Type 1, Grade 1, Class B classification

Dyneon™ TF 2029 Z PTFE is an ideal grade for tapes with high mechanical strength, such as electrical tape for wrapped insulations or flat cables. Also ideal for yarn applications, including sewing and weaving yarn for filter and sealing materials. Product Features: - High molecular weight - Designed for low reduction ratios - High stretch ratio - Processable by standard paste extrusion methods - Can be used to extrude pipe liners requiring high green strength - Meets ASTM D4895-04 Type 1, Grade 1, Class B classification

Dyneon™ TF 2053 Z PTFE is an ideal grade for extrusion of tubing and cables requiring only moderately high reduction ratio. Product Features: - Processable by standard paste extrusion methods - Good overall balance of mechanical properties and processability - Emulsion Polymerization PTFE - Meets ASTM D4895-04 Type 1, Grade 1, Class C classification

Dyneon™ TF 2072 Z PTFE is an ideal grade for thin-wall, small diameter tubing and wire and cable insulations, processed by paste extrusion method at reduction ratio up to 3000:1. This product offers more economic processing because of larger usable preforms. Product Features: - High molecular weight - Needs less lubricant than TF 2071 Z (1-2 parts by weight) - Emulsion polymerization PTFE - Product grade with lower extrusion pressure than TF 2071 Z - Meets ASTM D4895-04 Type 1, Grade 1, Class C classification - Processing by standard paste extrusion methods

Dyneon™ TF 2073 Z PTFE is an ideal grade for the manufacture of high quality micro tubing as well as wire and cable insulations. This product is also ideal for very thin-wall, smallest diameter tubing with maximum reduction ratio of up to 4200:1. Product Features: - Needs less lubricant than TF 2072 Z PTFE - Emulsion polymerization PTFE - Product grade with lower extrusion pressure than TF 2070 Z PTFE - Wide processing range - Processing by standard paste extrusion methods - Meets ASTM D4895-04 Type 1, Grade 1, Class C classification - High molecular weight

Features and Benefits - Bimodal particle size distribution - Low settling tendency - Excellent film-forming properties - Low porosity - High gloss - Greater hardness

Features and Benefits - Meets ASTM D4894 Type lll, Grade 2 resin - Molding and ram extrusion powder with very good free-flow properties - Good metering properties - Good mold filling behavior - Improved particle coalescence - Denser polymer structure - Lower permeability - Substantially lower deformation under load - Improved weldability - Good electrical and mechanical properties - Increased modulus of elasticity

Features and Benefits - Meets ASTM D 4894 Type lll, Grade 1 resin - Non-free-flowing compression molding powder - Very fine particle size - Improved gel stability - Denser polymer structure, low permeation - Excellent flex life - Improved weldability - Lower deformation under load - Very good electrical and mechanical properties - Increased modulus of elasticity - Excellent for tall, thick-walled billets

Dyneon™ TFM™ 2001 Z PTFE is an ideal grade for high-performance applications with reduction ratios up to 1000:1. This product has a denser polymer texture providing lower gas permeability than standard PTFE. Product Features: - High molecular weight - Isotropic mechanical properties - Smooth surfaces and high transparency - Very good weldability - Emulsion polymerization PTFE - High stress cracking resistance - Meets ASTM D4895-04 Type 1, Grade 1, Class C classification - High pressure resistance - Processing by standard paste extrusion method

This standard flow compound consists of a mixture of 15% Fiberglass blended with PTFE.

Algoflon® L203 R is a white PTFE micronized powder produced from dispersion polymerization comprising loose agglomerates of sub-micron sized primary particles. Algoflon® L203 R can be de-agglomerated to sub-micron particle size by the application of shear providing a better dispersion and distribution of the PTFE particles in the application. Algoflon® L203 R is designed for use as additive in critical engineering and high-end performance host materials such as thermoplastics, elastomers, coatings, inks and lubricants. Main features of Algoflon® L203 R include: - High specific surface area - Low molecular weight - Good blendability - Deaglomerated under shear - Improved lubricity - Reduced friction and wear

Algoflon® L206 R is a white PTFE micronized powder produced from dispersion polymerization comprising loose agglomerates of sub-micron sized primary particles. Algoflon® L206 R can be de-agglomerated to sub-micron particle size by the application of shear providing a better dispersion and distribution of the PTFE particles in the application. Algoflon® L206 R is designed for use as additive in critical engineering and high-end performance host materials such as thermoplastics, elastomers, coatings, inks and lubricants. Main features of Algoflon® L206 R include: - High specific surface area - Low molecular weight - Good blendability - Deaglomerated under shear - Improved lubricity - Reduced friction and wear

Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity. The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits. Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.

Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity. The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits. Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications. The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates. Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications. The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates. Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications. The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates. Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications. The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates. Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications. The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates. Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications. The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates. Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

PTFE, Linear Aromatic Polyester-Filled

Greene Tweed offers precision plastic components designed for a variety of demanding semiconductor applications. Avalon ® 56 HP, a high-performance, plastic-based thermoplastic on the latest generation modified PTFE, is ideal for improving the performance of wet wafer processing systems that require exceptional chemical resistance and very low extractable levels. In addition, Avalon ® 56 HP provides a very high level of purity, a wide temperature operating range, and superior low friction and dielectric properties.

Thermoset Resin Filled