A two component, high Tg, low CTE epoxy, designed for adhesive and sealing applications within the semiconductor, hybrid sensor device and fiber optic industries.

A single component, optically transparent, UV curable adhesive for opto-electronic applications including fiber packaging, LCD, LEDs, sensor devices, SCI-OEM precision optics, and general electronic assembly. It is non-yellowing after cure as measured per ASTM D-1925.

EPO-TEK® OG116 is a single component, high index, high Tg, UV cure high viscosity adhesive. It was designed for optoelectronic applications including fiber optics packaging, sensor devices, SCI-OEM optics, and general electronic assembly.

EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries.

A single component, UV curable, flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK® OG133.

EPO-TEK® OG133-8 is a single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK® OG133-5, and a non-flow version of EPO-TEK® OG133-7.

EPO-TEK® OG142 is a single component, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical and scientific/OEM industries. It is a clear and colorless, high Tg epoxy.

EPO-TEK® OG142-112 is a single component, low viscosity epoxy for adhesive sealing and encapsulating fiber optic and opto-electronic packaging applications.

EPO-TEK® OG142-112-LH is a low halogen version of OG142-112. single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectric packaging applications.

EPO-TEK® OG142-4 is a thixotropic version of EPO-TEK® OG142.

A single component, UV cured, thixotropic adhesive for semiconductor, PCB and opto-electric assembly. Due to its paste like rhelogy, it may be screen printed or dispensed, and is suggested for glob top DAM applications, or precision bonding of active optical components. It is an opaque epoxy intended for use outside the beam pathway.

EPO-TEK® OG142-87 is a single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. It is a replacement version of EPO-TEK® OG142-13 with better bonding strength and moisture resistance.

EPO-TEK® OG142-95 is a single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications. It is a replacement version of EPO-TEK® OG142-17 with better bonding strength and moisture resistance.

A single component, semi-flexible epoxy adhesive designed for low stress bonding of fiber optic component applications. It is a thixotropic adhesive which can be applied by dispensing or screen printing techniques. It has a very long pot-life, capable of fast curing techniques.

EPO-TEK® OG154-1 is a single component, UV curable epoxy adhesive for the semiconductor, opto-electronics, medical, and scientific OEM industry. It is a replacement for EPO-TEK® OG154.

EPO-TEK® OG159-2 is a single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bond line control. Common applications include semiconductor, electro-optics, fiber optic, and scientific/OEM. It can be applied by screen printing or dispensing techniques. It is capable of coating, adhering, sealing, and encapsulating devices.

A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a low viscosity, all-purpose adhesive.

EPO-TEK® OG198-54 is a single component, low viscosity, electrically and thermally insulating UV cure, medical grade epoxy.

EPO-TEK® OG198-55 is a high viscosity, single component, electrically and thermally insulating, translucent UV cure epoxy. It is the more thixotropic version of EPO-TEK® OG198-54.

EPO-TEK® OG198-55-1 is a single component, high thixotropic cloudy UV cure epoxy which is electrically and thermally insulating. It is the thixotropic version of EPO-TEK® OG198-54.

EPO-TEK® OG198-55HV is a high viscosity version of EPO-TEK® OG198-55, the fastest version of epoxy UV cure system with excellent adhesion strength.

EPO-TEK® OG198-763 is a medium viscosity, single component, electrically and thermally insulating, translucent UV cure epoxy. It is an intermediate rheology between EPO-TEK® OG198-54 and OG198-55.

A single component, low viscosity, UV curable adhesive designed for curing in seconds. It is an all-purpose, general adhesive for optical applications including fiber optic components, DVD, medical, and PCB level electro-optics. It can also be used for sealing and coating applications.

UV curable adhesive designed for glob top encapsulation

A UV fast curing, optically clear adhesive offering compliance and high strength.

A two component, high Tg, low viscosity, optically opaque epoxy designed for packaging of fiber optics and opto-electronics. It can be used as an adhesive, seal or encapsulant for many types of fibers, components, packages and optics found in the sensor or scientific/OEM industries, as well as medical or telecomm devices.

A single component, semi-flexible epoxy adhesive designed for low stress bonding of fiber optic component applications. It is a thixotropic adhesive which can be applied by dspensing or screen printing techniques. It has a very long pot-life, capable of fast curing techniques.

A two component, slightly electrically conductive epoxy suggested for EMI and Rf shielding of sensor devices including IR detectors. Low viscosity, black color, IR opaque, fast cure, and reasonable pot-life are few of its traits. It was designed for adhering filter windows to opto-hybrids or the cap of TO-cans.

Two component, general purpose, very fast setting epoxy adhesive.

Two component, slightly thixotropic alternative to EPO-TEK® 302-3M. It is an epoxy adhesive/encapsulant designed for resisting moisture and damp heat in glob top applications.

Two component, slightly thixotropic alternative to 302-3M. It is an epoxy adhesive/encapsulant designed for resisting moisture and damp heat in glob top applications.

Low halogen snap curable thixotropic longer pot life version of EPO-TEK® 353ND

A two component, rapid setting, room temperature cure epoxy. It may be used for many adhesive and sealing applications found in semiconductor, electronics, medical, fiber optics, and electro-optical devices. This fast gelling epoxy is ideal for curing in situ or in the field.

A two component, optically clear, electrically and thermally insulating epoxy designed for adhesive, sealing, and encapsulation applications found in semiconductor, medical, filtration and scientific/OEM industries. It is a slightly higher viscosityand Tg alternative to EPO-TEK® 301.

EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors.

A two component, room temperature curing epoxy material.

A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging. It is a lower viscosity version of EPO-TEK® P1011-T.

Electrically conductive, modified polyimide adhesive designed for die-attach of semiconductors and hybrid IC packaging. It is a more viscous version of EPO-TEK® P1011.

A single component, solvent containing, low viscosity polyimide designed for high temperature applications found in semiconductor, hybrid, and optical applications. It is used mostly as a coating and dielectric layer. It can be used at high temperatures. It is a replacement for EPO-TEK® 390-1.

A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.